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    One-component moisture-curable composition, sealing material consisting of the composition, and solar cell module using the sealing material
    63.
    发明专利
    One-component moisture-curable composition, sealing material consisting of the composition, and solar cell module using the sealing material 有权
    单组分水分可固化组合物，密封材料的密封材料和使用密封材料的太阳能电池模块

    公开(公告)号：JP2013116976A

    公开(公告)日：2013-06-13

    申请号：JP2011265262

    申请日：2011-12-02

    Applicant: Cemedine Co Ltd ,  セメダイン株式会社

    Inventor： KANO SHINGO ,  HASHIMUKAI HIDEJI

    IPC: C08L101/02 ,  C08K3/00 ,  C08K5/10 ,  C08L23/26 ,  C09K3/10

    Abstract: PROBLEM TO BE SOLVED: To provide a one-component moisture-curable composition which can be preserved for a long term without performing a process of the destruction of a microcapsule or the like that is not performed in a usual one-component curable composition, and which is excellent in depth curability and a cure rate.SOLUTION: The one-component moisture-curable composition includes: (A) 100 parts by weight of a saturated hydrocarbon-based polymer having a hydroxyl group bonded to a silicon atom or a hydrolyzable group, and having a crosslinkable silicon group that can be crosslinked by forming a siloxane bond; (B) 1-150 parts by weight of a polycarboxylic acid ester having two or more ester bonds of a polycarboxylic acid and a 1-4C monoalcohol, and a solubility parameter δ(cal/cm)that is calculated by a method of Small shown by a formula (δ=dΣG/M) is at least 8.9 and at most 10.5; and (C) 1-300 parts by weight of an inorganic filler. In the formula, G denotes a molecule attraction constant, ΣG denotes a sum total G of atoms and atomic groups in the molecule, d denotes a density, and M denotes a molecular weight.

    Abstract translation: 要解决的问题：提供一种可以长期保存的单组分湿气可固化组合物，而不进行在通常的单组分可固化物中不进行的微胶囊等的破坏过程 组合物，并且其具有优异的深度固化性和固化速率。 解决方案：单组分湿气固化组合物包括：（A）100重量份具有与硅原子键合的羟基的饱和烃基聚合物或可水解基团，并且具有交联性硅基团， 可以通过形成硅氧烷键进行交联; （B）1-150重量份具有多元羧酸和1-4C一元醇的两个或多个酯键的多元羧酸酯，溶解度参数δ（cal / cm 3 SP POS =“POST” / SP>）通过公式（δ=dΣG/ M）所示的小的方法计算的 1/2 为至少8.9，最多为10.5; 和（C）1-300重量份的无机填料。 在该式中，G表示分子吸引常数，ΣG表示分子中原子和原子团的总和G，d表示密度，M表示分子量。 版权所有（C）2013，JPO＆INPIT

    Curable composition
    64.
    发明专利
    Curable composition 有权
    可固化组合物

    公开(公告)号：JP2012211299A

    公开(公告)日：2012-11-01

    申请号：JP2011204705

    申请日：2011-09-20

    Applicant: Cemedine Co Ltd ,  セメダイン株式会社

    Inventor： WATANABE HIROSHI ,  OKAMURA NAOMI ,  SAITO ATSUSHI ,  MIZUNO HIROHITO

    IPC: C08L101/10 ,  C08K3/22 ,  C08K5/057 ,  C08K5/5435

    CPC classification number: C09J143/04 ,  C08G65/336 ,  C08K5/0091 ,  C08K5/5435 ,  C08L101/10 ,  C08L2312/08 ,  C09J171/02

    Abstract: PROBLEM TO BE SOLVED: To provide a curable composition which exhibits excellent curability, adhesiveness, and storage stability and which does not require an organotin-type catalyst and is therefore highly safe.SOLUTION: The curable composition includes (A) an organic polymer which contains on average 0.8 or more crosslinking silicon group in one molecule and in which the main chain is not a polysiloxane, (B) a silane compound obtained by reacting a specific epoxysilane compound with a specific aminosilane compound at a ratio such that the amount of the epoxysilane compound is in the range of 1.5-10 mol relative to one mol of the aminosilane compound, and (C) a specific titanium catalyst, with the amounts of the silane compound (B) and the titanium catalyst (C) being 0.1-40 pts.mass and 0.1-40 pts.mass respectively relative to 100 pts.mass of the organic polymer (A).

    Abstract translation: 解决问题的方法：提供固化性，粘合性，贮存稳定性优异且不需要有机锡型催化剂的固化性组合物，因此安全性高。 解决方案：可固化组合物包含（A）在一分子中平均含有0.8个或更多个交联硅基团并且其中主链不是聚硅氧烷的有机聚合物，（B）通过使特定 环氧硅烷化合物与特定的氨基硅烷化合物的比例使得环氧硅烷化合物的量相对于一摩尔氨基硅烷化合物为1.5-10摩尔，和（C）特定的钛催化剂，其量为 硅烷化合物（B）和钛催化剂（C）相对于100重量份的有机聚合物（A）分别为0.1-40重量份和0.1-40重量份。 版权所有（C）2013，JPO＆INPIT

    Curable composition
    66.
    发明专利
    Curable composition 有权
    可固化组合物

    公开(公告)号：JP2012107103A

    公开(公告)日：2012-06-07

    申请号：JP2010256174

    申请日：2010-11-16

    Applicant: Cemedine Co Ltd ,  Soken Chem & Eng Co Ltd ,  セメダイン株式会社 ,  綜研化学株式会社

    Inventor： UENO YUMI ,  TAKEUCHI MASAMICHI ,  SAITO ATSUSHI ,  OKABE YUSUKE

    IPC: C08L101/10 ,  C09J11/06 ,  C09J125/06 ,  C09J133/00 ,  C09J143/04 ,  C09J171/02 ,  C09J201/10

    Abstract: PROBLEM TO BE SOLVED: To provide a curable composition and an adhesive composition excellent in transparency, workability, adhesiveness, storage stability, a rise in adhesiveness, and quick curability, particularly excellent in adhesiveness to PPS.SOLUTION: The curable composition includes a vinyl polymer (A) having a reactive silicic group, a polyoxyalkylene polymer (B) having a reactive silicic group, and a curing catalyst (C). The vinyl polymer (A) is one or more polymers selected from the group consisting of a ring-structure-containing vinyl polymer that contains a ring-structure-containing vinyl monomer unit (a-1) and another ring-structure-containing vinyl polymer that contains a ring-structure-containing vinyl monomer unit (a-1) and an alkyl ester (meth)acrylate monomer unit (a-2), wherein the content of the (a-1) in the vinyl polymer (A) is 10 mass% or more relative to the total amount of the (a-1) and the (a-2).

    Abstract translation: 要解决的问题：提供透明性，加工性，粘合性，保存稳定性，粘合性上升和快速固化性优异的固化性组合物和粘合剂组合物，对PPS的粘合性特别优异。 解决方案：可固化组合物包括具有反应性硅基的乙烯基聚合物（A），具有反应性硅基的聚氧化烯聚合物（B）和固化催化剂（C）。 乙烯基聚合物（A）是选自包含含环结构的乙烯基单体单元（a-1）和另一种含环结构的乙烯基聚合物的含环结构的乙烯基聚合物的一种或多种聚合物 其含有含环结构的乙烯基单体单元（a-1）和（甲基）丙烯酸烷基酯单体单元（a-2），其中乙烯基聚合物（A）中的（a-1） 相对于（a-1）和（a-2）的总量为10质量％以上。 版权所有（C）2012，JPO＆INPIT

    Flame-retardant thermoconductive curable composition having excellent storage stability
    69.
    发明专利
    Flame-retardant thermoconductive curable composition having excellent storage stability 有权
    具有优异储存稳定性的阻燃热固性可固化组合物

    公开(公告)号：JP2012001614A

    公开(公告)日：2012-01-05

    申请号：JP2010137225

    申请日：2010-06-16

    Applicant: Cemedine Co Ltd ,  セメダイン株式会社

    Inventor： OKABE YUSUKE ,  SAITO ATSUSHI

    IPC: C08L71/02 ,  C08K3/22 ,  C08L33/04

    Abstract: PROBLEM TO BE SOLVED: To provide a flame-retardant thermoconductive curable composition containing a polyoxyalkylene-based polymer having a high curing rate, having a crosslinkable silicon group and containing the aluminum hydroxide as a flame retardant, a (meth)acrylic ester-based polymer having a crosslinkable silicon group, and aluminum hydroxide, and having a high curing rate and excellent storage stability.SOLUTION: The curable composition includes: (A) 100 pts.wt. polyoxyalkylene-based polymer having a crosslinkable silicon group in which three hydrolyzable groups are bonded to one silicon atom, and which is crosslinkable by forming a siloxane bond by moisture, (B) 10-200 pts.wt. (meth)acrylic ester-based polymer having the crosslinkable silicon group, and (C) 20-300 pts.wt. aluminum hydroxide having >30 μm of particle diameter based on 100 pts.wt. organic components in the curable composition.

    Abstract translation: 要解决的问题：为了提供含有具有高固化速度的聚氧化烯类聚合物，具有交联性硅基并含有氢氧化铝作为阻燃剂的阻燃性导热固化性组合物，可以使用（甲基）丙烯酸酯 的具有交联性硅基的聚合物和氢氧化铝，并且具有高固化速度和优异的储存稳定性。 解决方案：可固化组合物包括：（A）100重量份 具有可交联硅基的聚氧化烯系聚合物，其中三个可水解基团与一个硅原子键合，并且可通过水分形成硅氧烷键而交联，（B）10-200重量份。 具有交联性硅基的（甲基）丙烯酸酯类聚合物，（C）20〜300重量份 基于100重量份的粒径>30μm的氢氧化铝 可固化组合物中的有机组分。 版权所有（C）2012，JPO＆INPIT

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