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公开(公告)号：JP5379500B2
公开(公告)日：2013-12-25
申请号：JP2009018164
申请日：2009-01-29
申请人： 株式会社エム・エー・ティ
IPC分类号： B24B1/00 , B24B41/06 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To execute stable slicing machining of a semiconductor chip by means of grinding or polishing. SOLUTION: An adhesive 2 is filled in a recessed part 11 provided at a holder 10, the semiconductor chip 3 is attached to the recessed part 11 from a surface 3a side of the semiconductor chip 3 after the adhesive 2 flows in a groove part 13 continuing to the recessed part 11, a grinding wheel spindle 51 for applying pressure to the semiconductor chip 3 is rotated together with rotation of a holder 10 in which the semiconductor chip 3 is incorporated to apply pressure to a back face 3b of the semiconductor chip 3 by the grinding wheel spindle 51 and to grind the back face 3b side of the semiconductor chip 3, a part on the back face 3b side of the semiconductor chip 3 protruded from a surface 10a of the holder 10 is ground until the grinding wheel spindle 51 reaches the surface 10a of the holder 10, and the depth of an aperture part 14 formed in a thickness direction of the holder 10 from the surface 10a of the holder 10 with the same depth as the recessed part 11 is measured to check the thickness of the semiconductor chip 3. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5364175B2
公开(公告)日：2013-12-11
申请号：JP2011552183
申请日：2010-02-26
申请人： チタニウム メタルス コーポレイション
发明人： コーリー ディーン , ジョーンズ デイヴィッド
CPC分类号： B23P25/00 , B23P15/00 , B24B13/0043 , Y10T428/12417
摘要： The present invention relates to a method for profiling a surface of a sheet product (200), said sheet product having a first profile on a first surface, comprising: (a) creating a profiling support surface; (b) arranging said sheet product on said support surface; (c) conforming said sheet product to said support surface, wherein said conformance causes said sheet product to have a second surface profile on said first surface; and (d) processing said sheet product to form a third surface profile on said first surface.
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公开(公告)号：JP5336699B2
公开(公告)日：2013-11-06
申请号：JP2006251918
申请日：2006-09-15
申请人： 株式会社ノリタケカンパニーリミテド
摘要： PROBLEM TO BE SOLVED: To provide a crystal material polishing method capable of obtaining sufficient polishing efficiency and polishing performance in polishing with a CMP method even in the case of polishing a material hard to be machined such as a single-crystal substrate composed of silicon carbide SiC and gallium nitride GaN. SOLUTION: In polishing using the CMP method, the surface of a material hard to be machined such as a single-crystal substrate composed of silicon carbide SiC and gallium nitride GaN is polished by using a polishing pad including abrasive grains under the existence of oxidative polishing liquid, and high polishing efficiency can be thereby properly obtained, keeping low surface roughness. COPYRIGHT: (C)2008,JPO&INPIT
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85.发明专利Method for manufacturing glass substrate for information recording medium, and polishing liquid 审中-公开用于制造信息记录介质的玻璃基板的方法和抛光液
公开(公告)号：JP2013211068A
公开(公告)日：2013-10-10
申请号：JP2012079518
申请日：2012-03-30
申请人： Konica Minolta Inc , コニカミノルタ株式会社
发明人： NAKAE HAZUKI , SAKAMOTO AKIHIRO , TSUKADA KAZUYA
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing glass substrates for information recording media, even when reducing a polishing step such as not performing a coarse polishing step of performing polishing with a polishing liquid containing cerium oxide, having substantially high smoothness and substantially suppressing an occurrence of end face sagging.SOLUTION: The method for manufacturing glass substrates for information recording media includes a polishing step of moving a glass substrate 10 and a polishing pad 15 relative to each other, with a polishing liquid 16 supplied thereto and polishing the surface of the glass substrate 10. The polishing liquid 16 used is a polishing liquid containing a silica sol in which colloidal silica with an average particle size of 5-15 nm is dispersed, and the average particle size of the colloidal silica in the polishing liquid 16 is 20-30 nm.
摘要翻译： 要解决的问题：为了提供一种用于制造信息记录介质的玻璃基板的方法，即使在减少抛光步骤，如不进行用含有氧化铈的研磨液进行抛光的粗抛光步骤，具有基本上高的平滑度和基本上抑制 发生端面下垂。解决方案：用于制造用于信息记录介质的玻璃基板的方法包括：抛光步骤，用于将玻璃基板10和抛光垫15相对于彼此移动，并将抛光液16抛光 使用的研磨液16是含有平均粒径为5〜15nm的胶态二氧化硅的硅溶胶的研磨液，研磨液16中的胶体二氧化硅的平均粒径 是20-30nm。
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公开(公告)号：JP5263655B2
公开(公告)日：2013-08-14
申请号：JP2008087515
申请日：2008-03-28
申请人： 日立金属株式会社
发明人： 智寿 小方
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and method for processing a forming die, (a) completely removing grinding chips generated one after another following formation of a formed groove from a bottom part of the forming groove, (b) eliminating need of a large size pump for removing the grinding chips, and preventing the grinding chips from sticking in the pump, and (c) improving manufacturing efficiency for the die in processing a die material attached to a tool the formed groove by a circular thin blade grinding wheel after forming a clay supply hole in the die material, with respect to the apparatus and method for processing the forming die that has the clay supply hole and the formed groove communicated with the clay supply hole. SOLUTION: The processing apparatus includes a tool base in which the die material having a groove forming surface for forming the formed groove and a hole processing surface for providing the clay supply hole is set. The tool base includes a pressure chamber to be filled with cutting fluid, and the cutting fluid is pressurized to 0.01 to 1 MPa. COPYRIGHT: (C)2010,JPO&INPIT
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公开(公告)号：JP5253419B2
公开(公告)日：2013-07-31
申请号：JP2009551884
申请日：2008-03-03
发明人： ハイアット・グレゴリー , サハスラブデ・アビジット
CPC分类号： B24B27/0061 , B23B3/168 , B24B51/00 , B24B53/005 , Y10T29/511
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公开(公告)号：JP5252814B2
公开(公告)日：2013-07-31
申请号：JP2007067520
申请日：2007-03-15
发明人： ウー，ミアンシュエ , エー． カーマン，リー , アスペンシェー，ラルス
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公开(公告)号：JP2013134793A
公开(公告)日：2013-07-08
申请号：JP2011284293
申请日：2011-12-26
发明人： SUZUKI TETSUO , TANAKA ATSUSHI
CPC分类号： Y02P40/57
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of a defect such as a surface flaw, a chipping, a scratch or a surface crack defect in manufacture of a glass substrate.SOLUTION: A suction plate 59 at a tip of a first arm 58 sucks a doughnut-like glass substrate 4 at the top layer of a doughnut-like glass block 3. When a pressure sensor 61 detects the suction by the suction plate 59, the first arm 58 is pulled up and the glass substrate 4 is separated from the glass block 3. The glass substrate 4 is moved to a disk holder 54 by a cylinder 56, and when a position sensor 60 detects that the glass substrate 4 reaches a prescribed position, a pump 57 releases the suction and the glass substrate 4 is stored in the disk holder 54. A bonding agent F at the top layer of the glass block 3 is peeled off from a glass substrate 4 in a layer below it by sweeping its surface while pressing it by a roller 62a at a tip of a second arm 62. The bonding agent F which has been peeled off is led to a prescribed recovery position by a water flow in a water tank 51.
摘要翻译： 要解决的问题：为了防止在制造玻璃基板时发生诸如表面缺陷，碎裂，划痕或表面裂纹缺陷等缺陷。解决方案：第一臂58的尖端处的吸板59吸 在环状玻璃块3的顶层的环状玻璃基板4。当压力传感器61检测到吸引板59的吸力时，第一臂58被拉起，玻璃基板4与 玻璃基板4通过圆筒56移动到盘保持件54，并且当位置传感器60检测到玻璃基板4达到规定位置时，泵57释放吸力并且存储玻璃基板4 在玻璃块保持器54中。玻璃块3的顶层上的粘合剂F通过在其下方的玻璃基板4上扫过其表面，同时通过第二臂的尖端处的辊62a 已经剥离的粘合剂F被引导到预浸料 通过水箱51中的水流引起的恢复位置。
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公开(公告)号：JP2013129024A
公开(公告)日：2013-07-04
申请号：JP2011280541
申请日：2011-12-21
申请人： Disco Corp , 株式会社ディスコ
发明人： ICHIKAWA KIYOHISA
摘要： PROBLEM TO BE SOLVED: To provide a method for dividing a workpiece, with which chipping produced at the side face of a chip having a quadrangular prism-like shape can be restrained during cutting work.SOLUTION: The method for dividing the workpiece W for dividing the workpiece W into chips each having a quadrangular prism-like shape, by cutting the workpiece stuck onto a substrate S by wax H by a cutting blade, includes: a first cutting step of cutting the workpiece W twice or more in parallel in a first direction to divide the workpiece W into strip-like pieces Ws each having the same width as that of the chip; a strip-like piece sideways moving step of moving the strip-like pieces Ws in a state where the wax H is melted to make the adjacent strip-like pieces Ws abut on one another and moving all of the strip-like pieces Ws sideways without a gap; and a second cutting step of cutting the abutted strip-like pieces Ws twice or more times in parallel in a second direction orthogonal to the first direction to divide the workpiece W into chips each having the quadrangular prism-like shape, after the strip-like piece sideways moving step.
摘要翻译： 要解决的问题：提供一种用于分割工件的方法，在切割工作期间可以抑制在具有四棱柱形状的芯片的侧面处产生的切屑。方法：将工件W分割的方法 工件W成为具有四棱柱状形状的芯片，通过切割刀片通过蜡H切割粘贴到基板S上的工件，包括：第一切割步骤，在第一切割工序中平行切割工件W两次以上 将工件W分割成与芯片的宽度相同的条状片W的方向; 在蜡H熔化的状态下使带状片Ws移动以使相邻的条状片Ws彼此抵接并且将所有带状片Ws侧向移动而没有 一个沟; 以及第二切割步骤，在与第一方向正交的第二方向上平行地切割相邻的条状片Ws两次或更多次，以将条形状分割成具有四棱柱状形状的片状物 片横向移动步。
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