公开(公告)号：JP5334062B2

公开(公告)日：2013-11-06

申请号：JP2010245155

申请日：2010-11-01

Applicant: 三星エスディアイ株式会社Samsung SDI Co.,Ltd.

Inventor： 源燮 徐 ,  智祥 黄 ,  經憲 許 ,  基成 金

IPC: H01M4/04 ,  B05D1/26

CPC classification number: B05C5/0262 ,  B05C5/0245 ,  B05C5/0254 ,  B05C5/0266 ,  B05D1/265 ,  B29C47/165 ,  B29C47/92 ,  H01M4/0404

Abstract: An active material coating apparatus forms an active material layer having a uniform thickness across the width of a substrate. The active material coating apparatus includes a lower die having a groove for supplying an active material of a slurry state and forming a first lip portion of an outlet slot connected to the groove and outputting the active material; an upper die disposed on an upper side of the lower die to face the first lip portion, having a second lip portion of the outlet slot, and having a hinge portion at the rear of the second lip portion according to the outlet direction of the active material; a fixing spacer interposed between the lower die and the upper die at the rear of the hinge portion according to the outlet direction of the active material and determining a fixing gap; a flexible spacer interposed between the first lip portion and the second lip portion on both sides of the width direction of the outlet slot and forming a variable gap; and a controller installed to the upper die and pushing/pulling the second lip portion with respect to the hinge portion to control the variable gap between the first lip portion and the second lip portion.