公开(公告)号：JP5271060B2

公开(公告)日：2013-08-21

申请号：JP2008307837

申请日：2008-12-02

Applicant: 株式会社ジェイ・イー・ティ

Inventor： 勝吉 中務 ,  智意 石川 ,  宏明 金高 ,  正行 渡瀬 ,  礼悟 佐藤

IPC: H01L21/304 ,  G02F1/13 ,  G02F1/1333

Abstract: PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of preventing the re-adhesion of contaminant and the like and improving a cleaning treatment effect. SOLUTION: The treatment apparatus includes a treatment tank where each substrate to be treated is erected and stored in a clearance between a pair of confronted first and second erection walls erected by leaving a prescribed interval, a treatment liquid is supplied and the surface treatment of the substrate to be treated is performed. In the first and second erection walls 2b and 3, a first fluid control means is arranged on an inner wall face of either confronted wall. The first fluid control means is formed of dimples a 1 to a n changing a flow of the treatment liquid between an inner wall face side where the fluid control means is arranged and a substrate face side of the substrate W to be treated. COPYRIGHT: (C)2010,JPO&INPIT