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公开(公告)号：JP2013189681A
公开(公告)日：2013-09-26
申请号：JP2012056595
申请日：2012-03-14
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
CPC分类号： H01R13/03 , C25D3/46 , C25D5/10 , C25D5/34 , H01H1/02 , Y10T428/12896 , Y10T428/24355
摘要： PROBLEM TO BE SOLVED: To provide a silver plating material excellent in wear resistance, to be used as a material of a contact or a terminal component such as a connector, a switch and a relay used in on-board or consumer electric wiring.SOLUTION: In a silver plating material, a silver plating film having a thickness of 10 μm or less is formed on a material composed of copper or a copper alloy or the like, the arithmetic average roughness Ra of the surface of the silver plating film is 0.1 μm or less, and the {111} orientation ratio of the silver plating film is 35% or higher. The silver plating material is such a silver plating material that the wear amount of the silver plating film (the thickness of the silver plating film to be worn) is smaller than 1 μm even when a silver rivet is slid 300,000 times under a load of 100 gf, that is, the ground of the silver plating material is not exposed after the silver rivet is slid 300,000 times under the load of 100 gf even though the thickness of the silver plating film is around 1 μm, so that wear resistance is extremely excellent.
摘要翻译： 要解决的问题：提供耐磨性优异的镀银材料，用作接触材料或端子部件，例如用于车载或消费电线中的连接器，开关和继电器。解决方案 ：在镀银材料中，在由铜或铜合金等构成的材料上形成厚度为10μm以下的镀银膜，镀银膜表面的算术平均粗糙度Ra为0.1 μm以下，银镀膜的{111}取向比为35％以上。 镀银材料是这样的镀银材料，即使在100重量的负载下将银铆钉滑动30万次时，镀银膜的磨损量（待磨损的镀银膜的厚度）也小于1μm gf，即使银镀层在100gf的负荷下滑动30万次之后，银镀层的表面也不露出，即使镀银膜的厚度为1μm左右，耐磨耗性极好 。
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公开(公告)号：JP2014198895A
公开(公告)日：2014-10-23
申请号：JP2013182736
申请日：2013-09-04
申请人： Dowaメタルテック株式会社 , Dowa Metaltech Kk
CPC分类号： C25D3/46 , B32B15/018 , C22C5/06 , C22C9/00 , C22F1/08 , C22F1/14 , C25D5/10 , C25D5/34 , C25D5/50 , C25D7/00 , H01H1/02 , H01H1/023 , H01H1/025 , H01H11/041 , H01H11/045 , H01H2011/046 , H01R13/03 , H01R2201/26 , Y10T428/12896
摘要： 【課題】曲げ加工性が良好であり且つ高温環境下で使用しても接触抵抗の上昇を抑制することができる、銀めっき材およびその製造方法を提供する。【解決手段】素材の表面または素材上に形成された下地層の表面に、銀からなる表層を形成する銀めっき材の製造方法において、1〜15mg/Lのセレンを含み且つフリーシアンに対する銀の質量比が0.9〜1.8である銀めっき浴中において電気めっきを行うことによって、銀からなる表層を形成した後、時効処理を行って、表層の{200}方位の面積分率が15%以上である銀めっき材を製造する。【選択図】図1
摘要翻译： 要解决的问题：提供一种具有令人满意的弯曲加工性的镀银材料，即使在高温环境下使用也能够抑制接触电阻的增加及其制造方法。 为了制备在原料表面上形成银的表面层或形成在原料上的接地层表面上的镀银材料，在含有1〜15mg硒的银镀浴中进行电镀 / L，银与游离青色的质量比为0.9〜1.8，形成由银制成的表面层，然后进行时效处理，制作镀银材料，其中{200}中的面积分数 表面层的面积为15％以上。
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3.发明专利
公开(公告)号：JP2008248371A
公开(公告)日：2008-10-16
申请号：JP2007094971
申请日：2007-03-30
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
发明人： OGATA MASAFUMI , ITO MASAKI
IPC分类号： C25D5/12
摘要： PROBLEM TO BE SOLVED: To provide a highly corrosion resistant nickel-gold plating having high productivity by preventing the pitting due to a pinhole of a gold plating layer to enhance durability in nickel-gold plating.
SOLUTION: The gold plating member having high corrosion resistance and high productivity is nickel-gold plating of ≤0.05 in the arithmetic mean roughness (Ra) of the gold plating layer of the nickel plating layer in the nickel-gold plating having the nickel plating layer coated on a backing metal and the gold plating layer coated on the nickel plating layer.
COPYRIGHT: (C)2009,JPO&INPIT摘要翻译： 要解决的问题：通过防止由金镀层的针孔引起的点蚀以提高镍 - 镀金的耐久性，从而提供高生产率的高耐腐蚀性的镍 - 金电镀。 解决方案：具有高耐腐蚀性和高生产率的镀金部件在镍镀层中镀镍层的镀金层的算术平均粗糙度（Ra）为0.025以下的镀镍金镀层 涂覆在背衬金属上的镀镍层和涂覆在镀镍层上的镀金层。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2014080672A
公开(公告)日：2014-05-08
申请号：JP2013053412
申请日：2013-03-15
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
摘要： PROBLEM TO BE SOLVED: To provide a silver plated material having satisfactory bending workability, and in which the increase of contact resistance can be suppressed even if being used in a high temperature environment, and to provide a method for producing the same.SOLUTION: In the method for producing a silver plated material in which a surface layer made of silver is formed on the surface of a stock or the surface of a substrate layer formed on the stock, electroplating is performed in a silver plating bath comprising selenium of 1 to 15 mg/L, and in which the mass ratio of silver to free cyanogen is 0.9 to 1.8 to form a surface layer made of silver, thereafter, aging treatment is performed to produce a silver plated material in which all of the change rates of the X-ray diffraction peak intensities in the {111} face, the {200} face, the {220} face and the {311} face in the surface layer are 150% or less upon heating at 200°C for 60 min.
摘要翻译： 要解决的问题：提供具有令人满意的弯曲加工性的镀银材料，即使在高温环境中使用也可以抑制接触电阻的增加，并提供其制造方法。 在电镀表面上形成由银制成的表面层的镀银材料的制造方法或在电镀上形成的基板层的表面进行电镀，在含有1〜15的硒的镀银浴中进行 mg / L，其中银与游离氰的质量比为0.9〜1.8，形成由银制成的表面层，然后进行时效处理，制作镀银材料，其中X的全部变化率 在表面层的{111}面，{200}面，{220}面和{311}面的射线衍射峰强度在200℃加热60分钟时为150％以下。
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公开(公告)号：JP2012162775A
公开(公告)日：2012-08-30
申请号：JP2011024702
申请日：2011-02-08
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
摘要： PROBLEM TO BE SOLVED: To provide a silver plated material in which the thickness of a plated silver film is thin and which has excellent corrosion resistance without coating the surface of the plated silver film with an organic film, and to provide a method for manufacturing the silver plated material.SOLUTION: The plated silver film is characterized in that reflection density is ≥1.0 and a ratio of the integrated intensity of X-ray diffraction peak of the (111) plane to the total of integrated intensities of X-ray diffraction peaks of (111), (200), (220) and (311) planes is ≥40%. The plated silver film is formed on a raw material by using a silver plating solution comprising 80-250 g/L of silver potassium cyanide, 40-200 g/L of potassium cyanide, and 3-35 mg/L of Selenocyanic acid potassium to perform electroplating under such a condition that the temperature of the solution is 15-30 °C and current density is 3-10 A/dm.
摘要翻译： 要解决的问题：为了提供镀银银膜的厚度薄且耐腐蚀性优异的镀银材料，而不用有机膜涂覆镀银银膜的表面，并提供一种方法 用于制造镀银材料。 电镀银膜的特征在于，反射密度≥1.0，（111）面的X射线衍射峰的积分强度与X射线衍射峰的积分强度的总和的比例 （111），（200），（220）和（311）面为≥40％。 通过使用包含80-250g / L氰化银氰化银，40-200g / L氰化钾和3-35mg / L硒氰酸钾的镀银溶液，在原料上形成镀覆银膜， 在溶液温度为15-30℃，电流密度为3-10A / dm 2的条件下进行电镀。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2014181352A
公开(公告)日：2014-09-29
申请号：JP2013054805
申请日：2013-03-18
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
摘要： PROBLEM TO BE SOLVED: To provide a plating material which has an Au plating film formed on a conductive substrate through an Ag plating film and shows good bendability.SOLUTION: An Ag plating film of a thickness of 1-20 μm is formed as a ground layer on a conductive substrate composed of copper or a copper alloy, and an Au plating film of a thickness of 0.01-5 μm is formed on the surface of the ground layer. The area fraction in the {200} direction of the Ag plating film is at least 15%, preferably 25% or larger.
摘要翻译： 要解决的问题：提供一种通过Ag镀膜在导电性基板上形成有Au镀膜的电镀材料，并且显示出良好的弯曲性。溶液：形成厚度为1-20μm的Ag镀膜作为地面 在由铜或铜合金构成的导电性基板上形成厚度为0.01-5μm的Au镀膜的层，形成在接地层的表面上。 Ag镀膜的{200}方向的面积分数为15％以上，优选为25％以上。
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公开(公告)号：JP2012119308A
公开(公告)日：2012-06-21
申请号：JP2011234676
申请日：2011-10-26
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
摘要： PROBLEM TO BE SOLVED: To provide: an inexpensive silver plating material excellent in plating adhesion and capable of suppressing increase of plating contact resistance, even when used in a high-temperature environment; and a method for producing the silver plating material.SOLUTION: A silver plating material includes: a substrate layer comprising Ni, having a thickness of 0.01-1.0 μm and formed on a surface of a material comprising stainless steel; an intermediate layer comprising Cu, having a thickness of 0.01-0.2 μm and formed on the substrate layer; and a surface layer comprising Ag, having a thickness of 0.1-2.0 μm and formed on the intermediate layer. In the silver plating material, a crystalline diameter in the direction vertical to the (111) plane of the surface layer is 300 angstrom or more.
摘要翻译： 要解决的问题：提供：即使在高温环境下使用时，电镀附着性优异且能够抑制电镀接触电阻增加的廉价镀银材料， 和镀银材料的制造方法。 镀银材料包括：包含Ni的基底层，其厚度为0.01-1.0μm，并形成在包括不锈钢的材料的表面上; 包含厚度为0.01-0.2μm并形成在基底层上的Cu的中间层; 以及包含Ag的表层，其厚度为0.1〜2.0μm，形成在中间层上。 在镀银材料中，垂直于表层的（111）面的方向的结晶直径为300埃以上。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2014181391A
公开(公告)日：2014-09-29
申请号：JP2013057510
申请日：2013-03-21
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
CPC分类号： C25D5/10 , C25D3/46 , C25D5/34 , C25D7/00 , H01H1/025 , H01H11/041 , H01H2011/046 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a silver-plated material favorable in terms of heat resistance, flexural workability, and abrasion resistance.SOLUTION: In a silver-plated material obtained by forming, atop a material consisting of copper or copper alloy, a surface layer with a thickness of 10 μm or less consisting of silver, the out-of-plane orientation of the surface layer is improved by confining the half-value width of the rocking curve of a preferentially oriented face of the surface layer (preferably (200) face or (111) face) to 2 to 8°, preferably 3 to 7°, so as to improve the heat resistance, flexural workability, and abrasion resistance of the silver-plated material.
摘要翻译： 要解决的问题：提供在耐热性，弯曲加工性和耐磨性方面有利的镀银材料。溶解性：在由铜或铜合金构成的材料上形成的镀银材料中， 由银组成的厚度为10μm以下的层，通过限制表面层的优先取向面的摇摆曲线的半值宽度（优选（200））来提高表面层的面外取向 ）面或（111）面）至2至8°，优选3至7°，以提高镀银材料的耐热性，弯曲加工性和耐磨性。
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公开(公告)号：JP2014181354A
公开(公告)日：2014-09-29
申请号：JP2013054877
申请日：2013-03-18
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
摘要： PROBLEM TO BE SOLVED: To provide a silver plating material which consists of a base material, a ground layer of nickel formed on the base material and a front layer of silver formed on ground layer and has good bendability.SOLUTION: In a silver plating material, a ground layer of nickel is formed on a base material composed of copper or a copper alloy, and a front layer of siver of a thickness of 10 μm or smaller on the surface of the ground layer. The thickness of the ground layer is 2 μm or smaller, preferably 1.5 μm or smaller, and the area fraction of the front layer in the {200} direction is at least 15%, preferably 25% or larger.
摘要翻译： 要解决的问题：提供一种镀银材料，其由基材，形成在基材上的镍的接地层和形成在地层上的银的前层组成，并且具有良好的弯曲性。溶解性：在镀银材料 在由铜或铜合金构成的基体材料和在地层的表面上形成厚度为10μm以下的肝脏的前层形成镍的接地层。 接地层的厚度为2μm以下，优选为1.5μm以下，{200}方向的前层的面积分率为15％以上，优选为25％以上。
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公开(公告)号：JP2013189680A
公开(公告)日：2013-09-26
申请号：JP2012056586
申请日：2012-03-14
申请人： Dowa Metaltech Kk , Dowaメタルテック株式会社
摘要： PROBLEM TO BE SOLVED: To provide a silver plating material excellent in heat resistance, wear resistance and bendability.SOLUTION: On a surface of a material 12 composed of copper or a copper alloy, or on a surface of an underlayer composed of the copper or the copper alloy and formed on the material 12, a first silver plated layer 14 is formed in which the ratio of the X-ray diffraction intensity of a {200} surface with respect to the sum of the X-ray diffraction intensities of each of a {111} surface, a {200} surface, a {220} surface and a {311} surface is 40% or higher. On a surface of the first silver plated layer 14, a second silver plated layer 16 whose Vickers hardness Hv is 140 or greater is formed.
摘要翻译： 要解决的问题：提供耐热性，耐磨性和弯曲性优异的镀银材料。解决方案：在由铜或铜合金构成的材料12的表面上或由铜或铜合金构成的底层的表面上 铜合金形成在材料12上，形成第一镀银层14，其中{200}表面的X射线衍射强度与X射线衍射强度之和 {111}表面，{200}表面，{220}表面和{311}表面为40％以上。 在第一镀银层14的表面上形成维氏硬度Hv为140以上的第二镀银层16。
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