公开(公告)号：JP2017114966A

公开(公告)日：2017-06-29

申请号：JP2015249707

申请日：2015-12-22

申请人： Jsr株式会社 ,  Jsr Corp ,  Jsr株式会社

发明人： YAMADA HIRONARI ,  OKAMOTO TAKAHIRO ,  HOSHINO MOTOKI ,  SHINOMURA HISASHI ,  SHIBUYA KYOHEI ,  NODA MASAHIRO

IPC分类号： C09K3/14 ,  B24B37/00 ,  C09G1/02 ,  H01L21/304

摘要： 【課題】本発明では、ポリシリコンあるいはアモルファスシリコンの研磨用途において、高い除去速度で研磨可能な化学機械研磨用水系分散体、およびそれを用いた化学機械研磨方法を提供する。【解決手段】化学機械研磨用組成物であって、スルフィニル基を側鎖に有する繰り返し単位を有する重合体(A)を含有し、スルフィニル基を側鎖に有する繰り返し単位が、下記式(1)で表される。【化1】・・・・・(1)(式(1)中、R3は直接結合または炭素数1〜24の2価の有機基を示し、R4は置換基を有していてもよい炭素数1〜20のアルカンジイル基または置換基を有していてもよい炭素数6〜20のアリーレン基を示す。)【選択図】なし

公开(公告)号：JP2008229792A

公开(公告)日：2008-10-02

申请号：JP2007074718

申请日：2007-03-22

申请人： Jsr Corp ,  Jsr株式会社

发明人： SHIGETA KIMINARI ,  SHIBUYA KYOHEI

IPC分类号： B23Q11/00

摘要： PROBLEM TO BE SOLVED: To provide a suction device of cut chips capable of removing the cut chips generated in a tip in cutting to another place without scattering the cut chips in the vicinity of the tip or being clogged with the chips, and having excellent workability since a cover to surround a cutting tool is not installed.
SOLUTION: This suction device of cut chips removes the cut chips by sucking the cut chips generated when cutting a workpiece by the machine tool fixing the tip to a tip holder by a suction mechanism. In the suction device, a suction port of the suction mechanism is installed in the tip holder, and a suction port for sucking the cut chips cut from a cutting blade of the tip, a narrow part and a discharge port connected to a suction source are provided.
COPYRIGHT: (C)2009,JPO&INPIT

摘要翻译： 要解决的问题：提供一种切割芯片的抽吸装置，其能够将切割中产生的切割的切屑切割到另一个位置，而不会在切屑附近飞散或被芯片堵塞， 没有安装由于围绕切削工具的盖而具有优异的可加工性。 解决方案：切割芯片的这种抽吸装置通过吸收通过机械工具切割工件时产生的切割的切屑，通过抽吸机构将尖端固定到尖端保持器来移除切割的切屑。 在抽吸装置中，抽吸机构的吸入口安装在顶端保持器中，并且用于吸入从尖端的切割刀片切割的切屑的吸入口，连接到抽吸源的狭窄部分和排出口是 提供。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008221389A

公开(公告)日：2008-09-25

申请号：JP2007062590

申请日：2007-03-12

申请人： Jsr Corp ,  Jsr株式会社

发明人： YAMAMOTO MASAHIRO ,  MIYAUCHI HIROYUKI ,  MIHARA ITSUKI ,  SHIBUYA KYOHEI ,  MOTONARI MASAYUKI

IPC分类号： B24B37/20 ,  H01L21/304

摘要： PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad and method sufficiently suppressing generation of scratch in a surface to be polished of an object to be polished and having excellent polishing speed and uniformity in the surface to be polished.
SOLUTION: This chemical mechanical polishing pad has at least a polishing surface and a non-polishing surface to be a rear surface of the polishing surface. The polishing surface has a plurality of concentrically arranged annular grooves 1, and a plurality of circular recessed parts 2 arranged on a plurality of virtual straight lines 3 extending in a direction directed to a peripheral part of the polishing surface from the center part. The chemical mechanical polishing method is a method for chemically mechanically polishing the object to be polished by using the chemical mechanical polishing pad.
COPYRIGHT: (C)2008,JPO&INPIT

摘要翻译： 要解决的问题：提供一种化学机械抛光垫和充分抑制待抛光对象的待抛光表面的划痕并且具有优异的抛光速度和待抛光表面的均匀性的方法。 解决方案：该化学机械抛光垫至少具有抛光表面和非抛光表面，作为抛光表面的后表面。 抛光面具有多个同心布置的环形槽1和多个圆形凹入部分2，其布置在从中心部分朝向抛光表面的周边部分的方向延伸的多个虚拟直线3上。 化学机械抛光方法是通过使用化学机械抛光垫对被抛光物体进行化学机械抛光的方法。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008187117A

公开(公告)日：2008-08-14

申请号：JP2007021133

申请日：2007-01-31

申请人： JSR CORP

发明人： MIYAUCHI HIROYUKI ,  YAMAMOTO MASAHIRO ,  SHIBUYA KYOHEI ,  MOTONARI MASAYUKI ,  HOSAKA YUKIO

IPC分类号： H01L21/304 ,  B24B37/02 ,  B24B37/20

摘要： PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad excellent in polishing speed and in-plane uniformity of the polished surface, in which occurrence of scratch on the polished surface of an article to be polished is suppressed sufficiently. SOLUTION: The chemical mechanical polishing pad is provided with, in its polishing surface, a plurality of grooves in the shape of dashed-line extending from the central part toward the peripheral part. The grooves in the shape of dashed-line is linear and preferably consists of a group touching other group in the central part on the polishing surface and a group not touching other group in the central part on the polishing surface. COPYRIGHT: (C)2008,JPO&INPIT

公开(公告)号：JP2008187086A

公开(公告)日：2008-08-14

申请号：JP2007020801

申请日：2007-01-31

申请人： JSR CORP

发明人： MIYAUCHI HIROYUKI ,  YAMAMOTO MASAHIRO ,  SHIBUYA KYOHEI ,  MOTONARI MASAYUKI ,  HOSAKA YUKIO

IPC分类号： H01L21/304 ,  B24B37/20

摘要： PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad excellent in polishing speed and in-plane uniformity of polished surface, in which occurrence of scratch is suppressed sufficiently on the polished surface of an article to be polished. SOLUTION: The chemical mechanical polishing pad has a polishing surface consisting of a plurality of regions having a plurality of linear grooves extending in parallel wherein at least one linear groove in each region reaches the end of the polishing surface and the directions of the linear grooves in two adjoining regions are different from each other. COPYRIGHT: (C)2008,JPO&INPIT

公开(公告)号：JP2008187113A

公开(公告)日：2008-08-14

申请号：JP2007021111

申请日：2007-01-31

申请人： JSR CORP

发明人： MIYAUCHI HIROYUKI ,  YAMAMOTO MASAHIRO ,  SHIBUYA KYOHEI ,  MOTONARI MASAYUKI ,  HOSAKA YUKIO

IPC分类号： H01L21/304 ,  B24B37/20

摘要： PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad excellent in polishing speed and in-plane uniformity of the polished surface in which occurrence of scratch on the polished surface of an article to be polished is suppressed sufficiently. SOLUTION: The chemical mechanical polishing pad is provided, in its polishing surface, with a plurality of groups each consisting of a plurality of grooves extending in parallel and in close proximity to each other from the central part toward the peripheral part. The plurality of groups preferably consists of a group touching other group in the central part on the polishing surface, and a group not touching other group. COPYRIGHT: (C)2008,JPO&INPIT