公开(公告)号：JPH1041377A

公开(公告)日：1998-02-13

申请号：JP20936296

申请日：1996-07-22

Applicant: NHK SPRING CO LTD

Inventor： KAYAMOTO TAKASHI ,  KAI MITSURU ,  HANAMACHI TOSHIHIKO

IPC: B23Q3/15 ,  H01L21/68 ,  H01L21/683

Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck which has high heat transfer efficiency and has excellent strength and durability. SOLUTION: Between a lower insulating layer 6 of an electrostatic chuck 5 and a base member 1, damper layer 2-4 are formed which are made of a composite material wherein the ratio of an addition agent to matrix metal varies in such a way that the coefficient of thermal expansion may become gradually higher from the lower insulating layer 6 side toward the base member 1 side in a specified range between the coefficient of thermal expansion of the lower insulating layer 6 and that of the base member 1. By forming the damper layers 2-4, the difference in coefficient of thermal expansion between the lower insulating layer 6 and the base member 1 is absorbed well and the appearance of thermal stress can be prevented and thereby the strength and the durability of the device are increased. Especially, by brazing the electrostatic chuck 5 on the base member 1 or stacking the lower insulating layer 6, an electrode layer 7, and an upper insulating layer 8 on the base member 1 by flame coating or evaporation, the heat transfer efficiency between the layer is increased and thereby the cooling/heating efficiency of an object to be chucked such as a wafer is increased.