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    카메라 모듈
    25.
    发明公开
    카메라 모듈 有权
    相机模块

    公开(公告)号：KR1020100103969A

    公开(公告)日：2010-09-29

    申请号：KR1020090022067

    申请日：2009-03-16

    Applicant: 삼성전기주식회사

    Inventor： 이상진

    IPC: H04N5/225

    CPC classification number: H04N5/2253 ,  H04N5/2257 ,  H05K1/0218

    Abstract: PURPOSE: A camera module is provide to have power connection member which a ground terminal is formed between a housing and a shield case covering external side of the housing, and inter-electrically connect a substrate included on lower surface of the housing and the shield case without soldering process, thereby improving the workability and the productivity of a camera module. CONSTITUTION: A substrate has a plurality of connecting pad arranged on a upper specific side. A housing is mounted on upper side of the substrate. A lens barrel(130) is inserted to upper side of the housing and is vertically moved by driving device accepted within the housing. A power connecting member(140) is arranged to external side of the housing and have a ground terminal(145) which is arranged to at least one part.

    Abstract translation: 目的：提供一种照相机模块，其具有在壳体和覆盖壳体外侧的屏蔽壳体之间形成接地端子的电源连接构件，并且将包括在壳体的下表面上的基板与屏蔽壳体 无需焊接工艺，从而提高相机模块的可操作性和生产率。 构成：衬底具有布置在上部特定侧上的多个连接焊盘。 壳体安装在基板的上侧。 透镜镜筒（130）被插入壳体的上侧，并且通过壳体内接受的驱动装置垂直移动。 电源连接构件（140）布置在外壳的外侧，并具有布置在至少一个部分上的接地端子（145）。

    프린트 배선판용 쉴드 필름 및 프린트 배선판
    27.
    发明公开
    프린트 배선판용 쉴드 필름 및 프린트 배선판 有权
    印刷电路板印刷电路板和印刷电路板

    公开(公告)号：KR1020100051699A

    公开(公告)日：2010-05-17

    申请号：KR1020107004573

    申请日：2008-07-16

    Applicant: 다츠다 덴센 가부시키가이샤

    Inventor： 토토유기마사유키 ,  카미노켄지 ,  모리모토쇼헤이 ,  카와카미요시노리

    IPC: H05K9/00 ,  H05K1/02 ,  B32B15/04 ,  B32B3/28

    CPC classification number: H05K9/0084 ,  H05K1/0218 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/0715

    Abstract: Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0 μm, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film.

    Abstract translation: 提供一种用于印刷线路板的屏蔽膜和印刷线路板。 在屏蔽膜中，金属层由于弯曲半径大而弯曲半径小（1.0mm）的反复弯曲和滑动而不容易断裂。 用于印刷电路板的屏蔽膜（10）设置有形成在绝缘层（1）的一个表面上的金属层（2）。 绝缘层（1）的一个表面的算术平均粗糙度（JIS B 0601（1994年））为0.5-5.0μm，金属层（2）沿波纹状结构沿着 绝缘层（1）。 印刷电路板通过将屏蔽膜（10）附接到基膜来提供。

    Printed circuit board assembly and information technology equipment
    29.
    发明公开
    Printed circuit board assembly and information technology equipment 无效
    印刷电路板组件和信息技术设备

    公开(公告)号：KR20100023012A

    公开(公告)日：2010-03-03

    申请号：KR20100000742

    申请日：2010-01-06

    Applicant: FUJITSU LTD

    Inventor： TANAKA YOSHIRO ,  HOMMA TOSHIYUKI ,  KAMIKAKOI HIDEAKI

    IPC: H05K9/00

    CPC classification number: H05K1/0218 ,  H01R13/6599 ,  H05K1/141 ,  H05K9/0018 ,  H05K9/0084 ,  H05K2201/10189 ,  H05K2203/1311

    Abstract: PURPOSE: A print board assembly and an information technology device are provided to control the amount of used electric wave absorption sheet while efficiently shielding electric wave with small size wave absorption sheet which can cover only the side of a connector without requiring the wave absorption sheet which can cover the entire surface of a memory cover. CONSTITUTION: A print board assembly and an information technology device includes a print board(16), connectors(14A,14B), and electric wave absorption sheets(34A,34B). The connector is loaded on the print board in parallel and composed so that memory modules(10A,10B) are connected. The electric wave absorption sheet is installed on one side of the connector and attached to cover side of the connector.

    Abstract translation: 目的：提供一种印刷电路板组件和信息技术装置来控制所使用的电波吸收片的量，同时有效地屏蔽电波，其中小波吸收片只能覆盖连接器的侧面，而不需要吸波片 可以覆盖记忆盖的整个表面。 构成：印刷电路板组件和信息技术装置包括印刷板（16），连接器（14A，14B）和电波吸收片（34A，34B）。 连接器并联装载在打印板上，并组装成使得存储器模块（10A，10B）被连接。 电波吸收片安装在连接器的一侧并连接到连接器的盖侧。

    프린트 배선판 및 그것을 이용한 전자기기
    30.
    发明公开
    프린트 배선판 및 그것을 이용한 전자기기 有权
    打印电路板和使用它的电子设备

    公开(公告)号：KR1020100018619A

    公开(公告)日：2010-02-17

    申请号：KR1020107000748

    申请日：2008-06-27

    Applicant: 캐논 가부시끼가이샤

    Inventor： 이시카와코지

    IPC: H05K1/02

    CPC classification number: H05K1/0218 ,  H04N5/2253 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/0715 ,  H05K2201/09072 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/10121 ,  H05K2201/10189

    Abstract: A print circuit board includes a first layer on which a land is formed, a second layer on which an analog signal pattern and a first ground pattern are wired, a third layer on which a digital signal pattern and a second ground pattern are wired, and a fourth layer on which a third ground pattern is wired. The digital signal pattern is vertically sandwiched between the first ground pattern and the third ground pattern. The analog signal pattern and digital signal pattern are arranged without overlapping each other on the projection plane. The analog signal pattern and second ground pattern are arranged so as to overlap each other.

    Abstract translation: 印刷电路板包括其上形成有焊盘的第一层，连接模拟信号图案和第一接地图案​​的第二层，数字信号图案和第二接地图案布线在其上的第三层;以及 其上布置有第三接地图案的第四层。 数字信号图案垂直夹在第一接地图案​​和第三接地图案之间。 模拟信号图案和数字信号图案在投影平面上彼此不重叠地布置。 模拟信号图案和第二接地图案被布置成彼此重叠。

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