열전도성 실리콘 조성물, 그의 경화물 및 부설 방법 및이를 이용한 반도체 장치의 방열 구조체
    9.
    发明公开
    열전도성 실리콘 조성물, 그의 경화물 및 부설 방법 및이를 이용한 반도체 장치의 방열 구조체 有权
    导热硅酮组合物,其固化产品及其制备方法,以及使用其的半导体器件的热释放结构

    公开(公告)号:KR1020030047839A

    公开(公告)日:2003-06-18

    申请号:KR1020020078114

    申请日:2002-12-10

    IPC分类号: C08L83/04

    摘要: PURPOSE: To obtain a thermally conductive silicone composition having high heat- releasing performance. CONSTITUTION: The silicone composition comprises (A) 100 pts.wt. of an organopolysiloxane having in one molecule at least two alkenyl groups and a viscosity of 10-100,000 mm¬2/s at 25°C, (B) an organohydrogenpolysiloxane having in one molecule at least two hydrogen atoms directly bound to a silicon atom in such an amount as to be 0.5-5.0 in the ratio: (total number of the hydrogen atoms directly bound to the silicon atom)/(total number of the alkenyl groups in the component A), (C) low- melting metallic powder 40-250°C in melting temperature and 0.1-100 μm in mean particle size, (D) a highly thermally conductive filler 0.1-100 μm in mean particle size in such an amount as to be 800-2,200 pts.wt. in the total amount of the components C and D and 0.05-0.9 in the weight ratio: C/(C+D), (E) 0.1-500 ppm, on a platinum basis, of a catalyst selected from the group consisting of platinum and platinum compounds, based on the component A, and (F) 0.001-5 pt(s).wt. of an agent for controlling the activity of the catalyst E.

    摘要翻译: 目的:获得具有高散热性能的导热硅酮组合物。 构成:硅氧烷组合物包含(A)100重量份 的在一分子中具有至少两个烯基并且在25℃下粘度为10-100,000mm / 2 / s的有机聚硅氧烷,(B)在一分子中具有至少两个氢原子的有机氢聚硅氧烷直接与硅原子结合 这样的比例为:(与硅原子直接结合的氢原子的总数)/(成分A中的链烯基的总数)为0.5〜5.0,(C)低熔点金属粉末40 熔融温度为-250℃,平均粒径为0.1-100μm,(D)平均粒径为0.1〜100μm的高导热性填料,其量为800〜200重量份。 组分C和D的总量和0.05-0.9的重量比:C /(C + D),(E)0.1-500ppm,基于铂,选自铂 和基于组分A的铂化合物,和(F)0.001-5重量%。 的用于控制催化剂E的活性的试剂。