公开(公告)号：US20210385972A1

公开(公告)日：2021-12-09

申请号：US16896222

申请日：2020-06-09

申请人： CHIA-HSING LIU

发明人： CHIA-HSING LIU

IPC分类号： H05K7/20

摘要： A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.

公开(公告)号：US11206746B1

公开(公告)日：2021-12-21

申请号：US16896222

申请日：2020-06-09

申请人： Chia-Hsing Liu

发明人： Chia-Hsing Liu

IPC分类号： H05K7/20 ,  G06F1/20

摘要： A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body.