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    Method for applying a conductive trace pattern to a substrate
    1.
    发明授权
    Method for applying a conductive trace pattern to a substrate 失效
    将导电迹线图案应用于基板的方法

    公开(公告)号：US5114744A

    公开(公告)日：1992-05-19

    申请号：US614067

    申请日：1990-11-07

    申请人： Frank L. Cloutier ,  Ching K. Chieng ,  Siow W. Min

    发明人： Frank L. Cloutier ,  Ching K. Chieng ,  Siow W. Min

    IPC分类号： H05K3/10

    CPC分类号： H05K3/102 ,  H05K2201/0305 ,  H05K2203/013 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0522 ,  H05K2203/1545

    摘要： A fabrication method for applying electrically conductive circuit traces to a substrate is described. The method uses an ink composition which is applied to a selected substrate by an ink delivery system. The ink includes an adhesive in combination with other additives, including one or more sovlents. The ink is delivered by the ink jet system in a selected pattern, followed by the application of a powdered metal to the pattern which adheres to the adhesive in the ink. After the removal of excess powder, the substrate, pattern and powder are heated in an amount sufficient to melt the powder on the substrate. This produces a pattern of conductive traces geometrically corresponding to the ink pattern initially applied to the substrate.

    摘要翻译： 描述了一种用于将导电电路迹线施加到衬底的制造方法。 该方法使用通过油墨输送系统施加到所选择的基底上的油墨组合物。 油墨包括与其它添加剂组合的粘合剂，包括一种或多种油墨。 油墨由喷墨系统以选定的图案传送，随后将粉末状金属施加到附着在油墨中的粘合剂的图案上。 在除去多余的粉末之后，将基底，图案和粉末以足以熔化基底上的粉末的量加热。 这产生几何对应于最初施加到衬底的油墨图案的导电迹线图案。