公开(公告)号：US20120248176A1

公开(公告)日：2012-10-04

申请号：US13078824

申请日：2011-04-01

申请人： DERRICK Matthew HERRON ,  NING-CHENG LEE ,  FENGYING ZHOU

发明人： DERRICK Matthew HERRON ,  NING-CHENG LEE ,  FENGYING ZHOU

IPC分类号： B23K1/20 ,  B23K35/24 ,  B23K35/363

CPC分类号： B23K35/025 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/32

摘要： A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards.

摘要翻译： 提供了可以在高端应用中使用的焊料，其产生更耐冲击的焊点。 焊点具有很强的互连，可以在更耐冲击的同时执行焊接接头的所有正常功能。 此外，焊接点在诸如计算机或蜂窝电话的高端产品的使用寿命中保持其能力。 该焊料符合当今和未来焊接行业的要求，包括但不限于印刷或分配标准方法和符合健康和安全标准的能力。