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公开(公告)号:US20190247943A1
公开(公告)日:2019-08-15
申请号:US16392415
申请日:2019-04-23
发明人: Mark E. Tuttle
CPC分类号: B23K1/018 , B23K1/0016 , B23K3/029 , B23K3/03 , B23K3/08 , B23K2101/40 , B23K2101/42 , H01L22/32 , H01L24/799 , H01L24/98 , H01L2224/7999 , H01L2224/98
摘要: A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
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公开(公告)号:US20190234342A1
公开(公告)日:2019-08-01
申请号:US16258796
申请日:2019-01-28
申请人: TAMURA CORPORATION
发明人: Shoichi SAITO , Hisashi KIMOTO , Nobuo UCHIDA , Atsushi SHIDA
CPC分类号: F02G1/04 , B01D5/009 , B01D53/002 , B01D2258/06 , B23K1/0016 , B23K1/008 , F02G3/00 , F16D31/02
摘要: A gas purifying apparatus has: a compressing unit for corn pressing a gas in which an atmosphere or inert gas and a substance vaporized by heating have been mixed; and an expanding unit for liquefying the substance by expanding the gas compressed by the compressing unit, wherein the gas in which the substance has been reduced is obtained
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公开(公告)号:US20190193210A1
公开(公告)日:2019-06-27
申请号:US16290401
申请日:2019-03-01
CPC分类号: B23K35/0222 , B23K1/0016 , B23K1/203 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/362 , B23K2101/42 , C22C13/02 , H01L21/4853 , H01L24/00 , H01L24/29 , H01L24/45 , H01L24/48 , H01L2224/29211 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/014 , H01L2924/10253 , H01L2924/10272 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H05K3/3463 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.
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4.
公开(公告)号:US20190123463A1
公开(公告)日:2019-04-25
申请号:US15789449
申请日:2017-10-20
发明人: Jui-Feng Lee , Liang Kun Chang
CPC分类号: H01R12/7082 , B23K1/0016 , B23K1/012 , B23K2101/38 , H01R4/02 , H01R12/716
摘要: A connector structure used in pin in paste soldering includes a standoff region with dimensions that provide reflow air convection on at least two sides of a surface of the connector structure during Pin In Paste (PIP) soldering. For example, the standoff region has a depth or height of approximately 0.3 mm, a length of approximately 15.1 mm, and a width of approximately 4.95 mm. The standoff region can also have a depth or height in a range of 0.3 mm to 0.5 mm. The connector structure is a single or dual port connector structure with the standoff region configured as a void or gap proximate to the connector pins, which creates a reflow air convection gate way across a surface of the connector structure during PIP soldering.
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公开(公告)号:US20190099885A1
公开(公告)日:2019-04-04
申请号:US16143116
申请日:2018-09-26
申请人: Hakko Corporation
发明人: Yoshitomo TERAOKA , Satoshi MANDA
CPC分类号: B25J9/1664 , B23K1/0016 , B23K1/16 , B23K1/19 , B23K1/20 , B23K3/02 , B23K3/0615 , B23K3/063 , B23K3/08 , B23K2101/42 , B25J11/005 , H04B1/06
摘要: A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.
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公开(公告)号:US20190001426A1
公开(公告)日:2019-01-03
申请号:US15896025
申请日:2018-02-13
申请人: PROTEC CO., LTD.
发明人: MOO SUP SHIM , SEONG YONG JI , HYOUNG YEON JU , CHIHO CHO
CPC分类号: B23K3/0623 , B23K1/0016 , B23K3/087 , B23K2101/36 , H01L24/741 , H05K3/3426 , H05K2201/10757 , H05K2203/041
摘要: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
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公开(公告)号:US20180359864A1
公开(公告)日:2018-12-13
申请号:US16003474
申请日:2018-06-08
申请人: PITYU CONTROLS INC.
发明人: Stevan DOBI
CPC分类号: H05K3/3442 , B23K1/0016 , B23K2101/42 , H05K1/181 , H05K2201/09381 , H05K2201/09427 , H05K2201/10022 , H05K2201/10174 , H05K2201/10583 , H05K2203/048
摘要: A cradle for a metal electrode leadless face (MELF) device is provided. The cradle can include at least one pad, such as a solder pad, to be connected to a printed circuit board (PCB) or similar board. The pad can be configured to receive a MELF device. Such a configuration can improve positioning and alignment of the MELF device and prevent or reduce movement of the MELF device prior to or during soldering. The pad can include boundaries to engage the MELF device for alignment and to prevent or reduce movement. The boundaries of the pad can include inlets, extensions, troughs, borders, and/or other features to engage the MELF device. Boards including such cradles are also provided. Further, methods of installing a MELF device on a board using a cradle are also provided.
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公开(公告)号:US20180348258A1
公开(公告)日:2018-12-06
申请号:US16101643
申请日:2018-08-13
CPC分类号: G01R1/073 , B23K1/0016 , B23K1/20 , B23K2101/38 , B32B37/1284 , G01N27/07
摘要: The present disclosure discloses a conductivity sensor including a basic body of sintered ceramic having at least two cavities disposed on a frontal face and a metal electrodes disposed in each cavity. Each electrode is about one fifth the length of the basic body. Electrical cables extend from a rear face of the basic body into holes in each cavity and contact the electrodes. A solder paste or an electrically conductive adhesive disposed in each hole connects each cable with the respective metal electrode electrically and mechanically.
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9.
公开(公告)号:US20180346387A1
公开(公告)日:2018-12-06
申请号:US15778694
申请日:2016-11-08
CPC分类号: C04B37/02 , B23K1/0016 , B23K35/0233 , B23K35/025 , B23K35/286 , B23K2103/10 , B23K2103/172 , B23K2103/52 , C04B35/584 , C04B35/645 , C04B37/025 , C04B37/026 , C04B2235/3206 , C04B2235/96 , C04B2237/08 , C04B2237/121 , C04B2237/128 , C04B2237/368 , C04B2237/402 , C04B2237/52 , C04B2237/60 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , C22C21/00 , C22C21/02 , C22C29/16 , H01L23/12 , H01L23/13 , H01L23/3735 , H01L23/40 , H01L2224/32225 , H05K1/0306 , H05K1/05
摘要: A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.
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公开(公告)号:US20180301377A9
公开(公告)日:2018-10-18
申请号:US15423602
申请日:2017-02-03
发明人: Sehoon Yoo , Chang Woo LEE , Jun Ki KIM , Jeong Han KIM , Young Ki KO
IPC分类号: H01L21/768 , H01L23/48 , B23K1/00 , B23K3/06
CPC分类号: H01L21/76898 , B23K1/0016 , B23K1/20 , B23K3/06 , B23K3/0646 , B23K3/087 , B23K2101/40 , H01L23/481
摘要: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.
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