公开(公告)号：US06827629B2

公开(公告)日：2004-12-07

申请号：US10726650

申请日：2003-12-04

申请人： Dea-Yun Kim ,  Jae-Won Hwang ,  Eun-Ju Kang

发明人： Dea-Yun Kim ,  Jae-Won Hwang ,  Eun-Ju Kang

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B49/12

摘要： A polishing system controls the durations over which different layers on a substrate are sequentially polished. The polishing system polishes an upper layer using an endpoint detection technique and polishes a lower layer using a closed loop control technique. Once the lower layer is detected during the course of polishing the upper layer, the polishing system automatically enters the recipe for polishing the lower layer under a closed loop control mode.