公开(公告)号：US06827629B2

公开(公告)日：2004-12-07

申请号：US10726650

申请日：2003-12-04

申请人： Dea-Yun Kim ,  Jae-Won Hwang ,  Eun-Ju Kang

发明人： Dea-Yun Kim ,  Jae-Won Hwang ,  Eun-Ju Kang

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B49/12

摘要： A polishing system controls the durations over which different layers on a substrate are sequentially polished. The polishing system polishes an upper layer using an endpoint detection technique and polishes a lower layer using a closed loop control technique. Once the lower layer is detected during the course of polishing the upper layer, the polishing system automatically enters the recipe for polishing the lower layer under a closed loop control mode.

公开(公告)号：US06791972B1

公开(公告)日：2004-09-14

申请号：US09591246

申请日：2000-06-09

申请人： Jae-Won Hwang

发明人： Jae-Won Hwang

IPC分类号： H04L1266

CPC分类号： H04M7/006 ,  H04M3/42314 ,  H04M7/0096 ,  H04M7/12 ,  H04M2207/20 ,  H04Q3/62 ,  H04Q2213/13096 ,  H04Q2213/13106 ,  H04Q2213/13196 ,  H04Q2213/1322 ,  H04Q2213/1329 ,  H04Q2213/13389

摘要： An apparatus for interfacing a PBX with an ATM network, comprises a circuit switch part for establishing an ATM communication channel to connect the ATM network if a subscriber requests access to the ATM network, and an ATM network switch part for converting the signaling information from the ATM communication channel into the corresponding ATM network cell that is applied to the ATM network.

摘要翻译： 一种用于将PBX与ATM网络接口的装置，包括电路交换部分，用于在用户请求接入ATM网络的情况下建立ATM通信信道以连接ATM网络;以及ATM网络交换部分，用于将信令信息从 ATM通信信道进入应用于ATM网络的相应ATM网络小区。

公开(公告)号：US20160293484A1

公开(公告)日：2016-10-06

申请号：US15000302

申请日：2016-01-19

申请人： Jong-Jin Lee ,  Rak-Hwan Kim ,  Byung-Hee Kim ,  Jin-Nam Kim ,  Tsukasa Matsuda ,  Wan-Soo Park ,  Nae-In Lee ,  Jae-Won Chang ,  Eun-Ji Jung ,  Jeong-Ok Cha ,  Jae-Won Hwang ,  Jung-Ha Hwang

发明人： Jong-Jin Lee ,  Rak-Hwan Kim ,  Byung-Hee Kim ,  Jin-Nam Kim ,  Tsukasa Matsuda ,  Wan-Soo Park ,  Nae-In Lee ,  Jae-Won Chang ,  Eun-Ji Jung ,  Jeong-Ok Cha ,  Jae-Won Hwang ,  Jung-Ha Hwang

IPC分类号： H01L21/768

CPC分类号： H01L21/76882 ,  H01L21/76807 ,  H01L21/76843 ,  H01L21/76864 ,  H01L21/76877 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53238

摘要： In a method of forming a wiring structure, a lower structure is formed on a substrate. An insulating interlayer is formed on the lower structure. The insulating interlayer is partially removed to form at least one via hole and a dummy via hole. An upper portion of the insulating interlayer is partially removed to form a trench connecting the via hole and the dummy via hole. A first metal layer filling the via hole and the dummy via hole is formed. A second metal layer filling the trench is formed on the first metal layer.

摘要翻译： 在形成布线结构的方法中，在基板上形成下部结构。 在下部结构上形成绝缘中间层。 部分去除绝缘中间层以形成至少一个通孔和虚拟通孔。 绝缘中间层的上部被部分地去除以形成连接通孔和虚拟通孔的沟槽。 形成填充通孔和虚拟通孔的第一金属层。 填充沟槽的第二金属层形成在第一金属层上。