公开(公告)号：US5747982A

公开(公告)日：1998-05-05

申请号：US761047

申请日：1996-12-05

申请人： Douglas John Dromgoole ,  Anatoly Feygenson ,  Robert Charles Frye ,  Ashraf Wagih Lotfi ,  King Lien Tai

发明人： Douglas John Dromgoole ,  Anatoly Feygenson ,  Robert Charles Frye ,  Ashraf Wagih Lotfi ,  King Lien Tai

IPC分类号： H01L25/16 ,  H05K1/02 ,  G05F5/00 ,  H03H7/00

CPC分类号： H05K1/0256 ,  H01L25/162 ,  H05K1/0262 ,  H05K1/0274 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/1003 ,  Y10S323/902

摘要： A silicon-on-silicon dual MCM apparatus comprising a printed circuit board having a voltage isolation boundary contained therein supporting a pair of multi-chip modules on either side of the voltage isolation boundary. The MCMs safely convey signals across the isolation boundary via discrete optical coupling means or the like. The optical coupling means allow safe and efficient conveyance of signals across the voltage isolation boundary enabling a designer to group high voltage components on one side of the boundary and low voltage components on the other side of the boundary. This obviates to a degree the need for multi-layered PCBs. A relatively large number of passive components (resistors and capacitors) are integrated into a silicon substrate with flip-chip analog integrated circuits (ICs). Operational characteristics of the controller are verified after integration and are compared to the discrete version. High voltage isolation requirements, interference, and noise are all considered to determine the most critical portions of the dual MCM layout and design.

摘要翻译： 一种硅上硅双MCM装置，包括其中包含电压隔离边界的印刷电路板，其在电压隔离边界的两侧支撑一对多芯片模块。 MCM通过离散光耦合装置等将信号安全地传送到隔离边界。 光耦合装置允许跨越电压隔离边界安全有效地传输信号，使得设计人员可以对边界一侧的高压部件和边界另一侧的低电压部件进行分组。 这在一定程度上消除了对多层PCB的需求。 通过倒装芯片模拟集成电路（IC）将相对大量的无源元件（电阻和电容器）集成到硅衬底中。 控制器的操作特性在集成后验证，并与离散版本进行比较。 高电压隔离要求，干扰和噪声都被认为是确定双MCM布局和设计的最关键部分。