Adjustable lens mounting assembly
    1.
    发明授权
    Adjustable lens mounting assembly 有权
    可调节镜头安装组件

    公开(公告)号:US07978425B2

    公开(公告)日:2011-07-12

    申请号:US12191969

    申请日:2008-08-14

    Inventor: Eric Christison

    Abstract: A lens barrel is mated with a lens mount through use of a screw thread whereby relative rotation adjusts lens focus. The lens barrel and lens mount are additionally provided with an interengaging formation that is interposed between an optical axis of the lens barrel and the screw thread. This formation provides a cylindrical sliding contact which isolates any particles produced by operation of the screw thread from reaching the optical components at or near the optical axis.

    Abstract translation: 透镜筒通过使用螺纹与镜头座配合,由此相对旋转调节镜片对焦。 透镜镜筒和透镜支架还设置有插入在镜筒的光轴和螺纹之间的相互接合的构造。 该形成提供圆柱形滑动接触,其隔离由螺纹操作产生的任何颗粒在光轴处或附近到达光学部件。

    Method of manufacturing an image sensing micromodule
    2.
    发明授权
    Method of manufacturing an image sensing micromodule 有权
    制造图像感测微模块的方法

    公开(公告)号:US07956431B2

    公开(公告)日:2011-06-07

    申请号:US12254672

    申请日:2008-10-20

    Abstract: A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

    Abstract translation: 一种制造微型组件的方法,包括以下步骤:在由半导体材料制成的芯片的有源面上制造集成电路,使通过芯片的通孔电连接到集成电路,并将芯片插入 包括空腔和导电元件的盒子,所述芯片的有源面朝向所述空腔的底部设置,在所述芯片的侧面的至少一部分上形成由导电材料制成的导电横向层, 电连接到芯片的后表面的导电元件,并且通过在空腔中沉积导电材料而在导电横向层和导电元件之间产生连接。

    ADJUSTABLE LENS MOUNTING ASSEMBLY
    4.
    发明申请
    ADJUSTABLE LENS MOUNTING ASSEMBLY 有权
    可调节镜头安装组件

    公开(公告)号:US20090109554A1

    公开(公告)日:2009-04-30

    申请号:US12191969

    申请日:2008-08-14

    Inventor: Eric Christison

    Abstract: A lens barrel is mated with a lens mount through use of a screw thread whereby relative rotation adjusts lens focus. The lens barrel and lens mount are additionally provided with an interengaging formation that is interposed between an optical axis of the lens barrel and the screw thread. This formation provides a cylindrical sliding contact which isolates any particles produced by operation of the screw thread from reaching the optical components at or near the optical axis.

    Abstract translation: 透镜筒通过使用螺纹与镜头座配合,由此相对旋转调节镜片对焦。 透镜镜筒和透镜支架还设置有插入在镜筒的光轴和螺纹之间的相互接合的构造。 该形成提供圆柱形滑动接触,其隔离由螺纹操作产生的任何颗粒在光轴处或附近到达光学部件。

    METHOD OF MANUFACTURING AN IMAGE SENSING MICROMODULE
    5.
    发明申请
    METHOD OF MANUFACTURING AN IMAGE SENSING MICROMODULE 有权
    制造图像感测显微镜的方法

    公开(公告)号:US20090267172A1

    公开(公告)日:2009-10-29

    申请号:US12254672

    申请日:2008-10-20

    Abstract: A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

    Abstract translation: 一种制造微型组件的方法,包括以下步骤:在由半导体材料制成的芯片的有源面上制造集成电路,使通过芯片的通孔电连接到集成电路,并将芯片插入 包括空腔和导电元件的盒子,所述芯片的有源面朝向所述空腔的底部设置,在所述芯片的侧面的至少一部分上形成由导电材料制成的导电横向层, 电连接到芯片的后表面的导电元件,并且通过在空腔中沉积导电材料而在导电横向层和导电元件之间产生连接。

    CAMERA MODULES
    6.
    发明申请
    CAMERA MODULES 有权
    相机模块

    公开(公告)号:US20090109326A1

    公开(公告)日:2009-04-30

    申请号:US11931747

    申请日:2007-10-31

    Inventor: Eric Christison

    CPC classification number: H04N5/2254 H04N5/2257 Y10T29/5313

    Abstract: A camera module may include a mount and a barrel coupled to the mount. One of the barrel and the mount may include a polycarbonate material and the other of the barrel and the mount may include a liquid crystal polymer (LCP) material.

    Abstract translation: 相机模块可以包括安装件和联接到安装件的筒体。 筒体和安装座中的一个可以包括聚碳酸酯材料,并且筒体和安装座中的另一个可以包括液晶聚合物(LCP)材料。

    Lens Assembly
    7.
    发明申请
    Lens Assembly 有权
    镜头组件

    公开(公告)号:US20080170151A1

    公开(公告)日:2008-07-17

    申请号:US11946441

    申请日:2007-11-28

    Abstract: A lens assembly for an imaging device includes a lens for focusing external radiation towards an image sensor of the imaging device. A mounting member is between the lens and the image sensor so that the lens is spaced a set distance from the image sensor. An adjustment member varies position of the mounting member relative to the image sensor so that the set distance is varied.

    Abstract translation: 用于成像装置的透镜组件包括用于将外部辐射聚焦到成像装置的图像传感器的透镜。 透镜和图像传感器之间的安装构件,使得透镜与图像传感器间隔一定距离。 调节构件改变安装构件相对于图像传感器的位置,使得设定距离变化。

    Camera modules
    8.
    发明授权
    Camera modules 有权
    相机模组

    公开(公告)号:US08432484B2

    公开(公告)日:2013-04-30

    申请号:US11931747

    申请日:2007-10-31

    Inventor: Eric Christison

    CPC classification number: H04N5/2254 H04N5/2257 Y10T29/5313

    Abstract: A camera module may include a mount and a barrel coupled to the mount. One of the barrel and the mount may include a polycarbonate material and the other of the barrel and the mount may include a liquid crystal polymer (LCP) material.

    Abstract translation: 相机模块可以包括安装件和联接到安装件的筒体。 筒体和安装座中的一个可以包括聚碳酸酯材料,并且筒体和安装座中的另一个可以包括液晶聚合物(LCP)材料。

    IMAGING DEVICE
    9.
    发明申请
    IMAGING DEVICE 审中-公开
    成像装置

    公开(公告)号:US20080043134A1

    公开(公告)日:2008-02-21

    申请号:US11840316

    申请日:2007-08-17

    Abstract: The imaging device includes an image sensor, a lens member adapted to focus external radiation towards the image sensor and a heat shield to inhibit thermal damage to the lens member. The heat shield may include an optical filter between the lens member and the external radiation.

    Abstract translation: 成像装置包括图像传感器,适于将外部辐射聚焦到图像传感器的透镜构件和防止对透镜构件的热损伤的隔热罩。 隔热罩可以包括在透镜构件和外部辐射之间的滤光器。

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