摘要:
The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment. The system comprises an outer casing provided with a cassette transfer port through which a cassette is transferred, a cassette section having a cassette table arranged within an inner space surrounded by the outer casing for supporting the cassette transferred through the cassette transfer port, a sub-arm mechanism for taking the substrates one by one from the cassette section, a process section positioned adjacent to the cassette section and having a plurality of treating units for treating the substrates arranged therein, a main arm mechanism arranged within the process section for receiving the substrates from the sub-arm mechanism arranged in the cassette section and, then, transferring the received substrates to each of the treating units while transferring the treated substrates out of the treating units, an air supply mechanism for supplying a clean air to form a down-stream within the space surrounded by the outer casing, and a partition plate for partitioning the inner space surrounded by the outer casing not to interfere the down-flow of the air formed by the air supply mechanism, the partition plate having a substrate transfer port through which the substrate is transferred from one of the partitioned spaces to the other partitioned space.
摘要:
In this processing solution supplying apparatus, when restarting the hydrophobic process, the air in the supply pipe is exhausted outside before performing the hydrophobic process by using a transfer gas, bypassing the process chamber. Thus, a large-sized mist of HMDS staying inside the supply pipe is not supplied to the wafer as it is, and after restarting the hydrophobic process after a prolonged stoppage of the adhesion apparatus, the vapor or mist of HMDS can be supplied uniformly to the wafer.