Substrate treating system and substrate treating method
    1.
    发明授权
    Substrate treating system and substrate treating method 失效
    底物处理系统和底物处理方法

    公开(公告)号:US5876280A

    公开(公告)日:1999-03-02

    申请号:US864937

    申请日:1997-05-29

    摘要: The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment. The system comprises an outer casing provided with a cassette transfer port through which a cassette is transferred, a cassette section having a cassette table arranged within an inner space surrounded by the outer casing for supporting the cassette transferred through the cassette transfer port, a sub-arm mechanism for taking the substrates one by one from the cassette section, a process section positioned adjacent to the cassette section and having a plurality of treating units for treating the substrates arranged therein, a main arm mechanism arranged within the process section for receiving the substrates from the sub-arm mechanism arranged in the cassette section and, then, transferring the received substrates to each of the treating units while transferring the treated substrates out of the treating units, an air supply mechanism for supplying a clean air to form a down-stream within the space surrounded by the outer casing, and a partition plate for partitioning the inner space surrounded by the outer casing not to interfere the down-flow of the air formed by the air supply mechanism, the partition plate having a substrate transfer port through which the substrate is transferred from one of the partitioned spaces to the other partitioned space.

    摘要翻译: 本发明提供一种用于在空调环境下连续处理多个基板W的基板处理系统。 该系统包括设置有盒传送端口的外壳,盒传送通过该盒外壳,盒部具有设置在由外壳包围的内部空间内的盒式表台,用于支撑通过盒式磁带传送端口传送的磁带, 用于从盒部分逐个取出基板的臂机构,与盒部分相邻设置的处理部分,并具有用于处理布置在其中的基板的多个处理单元;布置在处理部分内用于接收基板的主臂机构 从设置在盒部中的副臂机构,然后将接收到的基板传送到每个处理单元,同时将处理过的基板从处理单元传送出去;空气供应机构,用于供应清洁空气, 在由外壳包围的空间内流动,以及用于分隔内部空间的分隔板 所述隔板由所述外壳围绕,不会干扰由所述供气机构形成的空气的向下流动,所述隔板具有基板传送口,所述基板通过所述基板传送口从所述分隔空间之一转移到所述另一个分隔空间。

    Processing solution supplying apparatus, processing apparatus and processing method
    2.
    发明授权
    Processing solution supplying apparatus, processing apparatus and processing method 有权
    处理液供应装置,处理装置及处理方法

    公开(公告)号:US06202653B1

    公开(公告)日:2001-03-20

    申请号:US09270805

    申请日:1999-03-17

    IPC分类号: B08B902

    CPC分类号: C23C16/4486 H01L21/67075

    摘要: In this processing solution supplying apparatus, when restarting the hydrophobic process, the air in the supply pipe is exhausted outside before performing the hydrophobic process by using a transfer gas, bypassing the process chamber. Thus, a large-sized mist of HMDS staying inside the supply pipe is not supplied to the wafer as it is, and after restarting the hydrophobic process after a prolonged stoppage of the adhesion apparatus, the vapor or mist of HMDS can be supplied uniformly to the wafer.

    摘要翻译: 在该处理液供给装置中,在重新开始疏水处理时,通过使用旁路处理室的转移气体进行疏水处理,将供给管内的空气排出到外部。 因此,不会直接向晶片供给HMDS的大尺寸的雾沫,并且在粘合装置长时间停止后重新开始疏水处理后,可以均匀地供给HMDS的蒸气或雾, 晶圆。