公开(公告)号：US20100244285A1

公开(公告)日：2010-09-30

申请号：US12659762

申请日：2010-03-19

申请人： Hirofumi Fukuda

发明人： Hirofumi Fukuda

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3135 ,  H01L21/561 ,  H01L24/02 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

摘要： In a semiconductor device, corner portions of a inner insulating film are chamfered, and hence a damage is less likely to reach the corner portion of the inner insulating film, though the corner portion of an outer insulating film is damaged. Therefore, a hermeticity of a semiconductor element can be effectively maintained, and the yield of semiconductor pellets can be improved. Moreover, since it is not necessary to chamfer the corner portion of the outer insulating film, the structure remains simple and the productivity can be improved.

摘要翻译： 在半导体装置中，内绝缘膜的角部被倒角，由于外绝缘膜的角部被破坏，因此损伤不太可能到达内绝缘膜的角部。 因此，能够有效地保持半导体元件的气密性，能够提高半导体芯片的成品率。 此外，由于不需要对外绝缘膜的角部进行倒角，所以结构保持简单，并且可以提高生产率。

公开(公告)号：US08143730B2

公开(公告)日：2012-03-27

申请号：US12659762

申请日：2010-03-19

申请人： Hirofumi Fukuda

发明人： Hirofumi Fukuda

IPC分类号： H01L23/29

CPC分类号： H01L23/3135 ,  H01L21/561 ,  H01L24/02 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

摘要： In a semiconductor device, corner portions of a inner insulating film are chamfered, and hence a damage is less likely to reach the corner portion of the inner insulating film, though the corner portion of an outer insulating film is damaged. Therefore, a hermeticity of a semiconductor element can be effectively maintained, and the yield of semiconductor pellets can be improved. Moreover, since it is not necessary to chamfer the corner portion of the outer insulating film, the structure remains simple and the productivity can be improved.

摘要翻译： 在半导体装置中，内绝缘膜的角部被倒角，由于外绝缘膜的角部被破坏，因此损伤不太可能到达内绝缘膜的角部。 因此，能够有效地保持半导体元件的气密性，能够提高半导体芯片的成品率。 此外，由于不需要对外绝缘膜的角部进行倒角，所以结构保持简单，并且可以提高生产率。

公开(公告)号：US5559678A

公开(公告)日：1996-09-24

申请号：US542350

申请日：1995-10-12

申请人： Hirofumi Fukuda ,  Kazuo Hatori ,  Kazumi Yamada ,  Toshiaki Nogiri ,  Kozo Mori

发明人： Hirofumi Fukuda ,  Kazuo Hatori ,  Kazumi Yamada ,  Toshiaki Nogiri ,  Kozo Mori

IPC分类号： H05K5/00 ,  H05K5/02 ,  H05K7/14 ,  H05K9/00

CPC分类号： H05K9/0062 ,  H05K7/1425

摘要： A box-shaped rack forming an electronic device housing has a plurality of guide grooves for guiding upper and lower edges of electronic circuit packages. A plurality of dummy surface plates are pivotably mounted on a front opening portion of the rack and arranged side by side. Each dummy surface plate is biased by a spring, so that when the electronic circuit package is not inserted in the rack, the dummy surface plate is kept in abutment against the inner surface of the rack to shield a part of the front opening portion of the rack. When the electronic circuit package is inserted into the rack, the dummy surface plate is pushed by the electronic circuit package to pivot inward of the rack, and is finally replaced in position by the package surface plate mounted on the electronic circuit package. When the electronic circuit package is removed from the rack, the dummy surface plate is reversely pivoted to restore an original position and again shield the part of the front opening portion of the rack. Accordingly, even when the electronic circuit package is inserted or exchanged during the operation of the electronic device, the occurrence of electromagnetic interference and the reduction in cooling efficiency can be prevented to thereby improve the efficiency of working such as exchanging of the electronic circuit package.

摘要翻译： 形成电子设备壳体的盒形齿条具有用于引导电子电路封装的上边缘和下边缘的多个引导槽。 多个虚拟表面板可枢转地安装在齿条的前开口部分并排设置。 每个虚拟表面板被弹簧偏压，使得当电子电路封装未插入到支架中时，虚拟表面板保持抵靠在机架的内表面上，以遮蔽 架。 当电子电路封装被插入到机架中时，虚拟表面板被电子电路封装件推动以使其枢转到支架的内部，并且最终被安装在电子电路封装上的封装表面板替换。 当将电子电路封装从机架中取出时，虚拟表面板反向枢转以恢复原始位置，并再次屏蔽机架前部开口部分的一部分。 因此，即使在电子设备的操作期间插入或更换电子电路封装时，也可以防止电磁干扰的发生和冷却效率的降低，从而提高诸如电子电路封装的更换的工作效率。