公开(公告)号：US20130271251A1

公开(公告)日：2013-10-17

申请号：US13571381

申请日：2012-08-10

Applicant: Shih-Hsien Tseng ,  Wen-Hsiung Liao ,  Joseph D.S. Deng ,  Ian-Chun Cheng

Inventor： Shih-Hsien Tseng ,  Wen-Hsiung Liao ,  Joseph D.S. Deng ,  Ian-Chun Cheng

IPC: H01F5/00 ,  H01F41/04

CPC classification number: H01F41/042 ,  H01F17/0013 ,  H01F2017/0066

Abstract: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.

Abstract translation: 本发明公开了一种无基板电子部件。 导电元件设置在多个绝缘层中，其中多个绝缘层不被衬底支撑。 可以在去除衬底之前，在衬底上的多个导电层或绝缘层上执行膜工艺来制造无衬底电子部件。 在一个实施例中，可以在衬底上形成缓冲层。 在该过程完成之后，可以容易地去除缓冲层以使衬底与衬底上的层分离。