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    CONTROL SYSTEM FOR SEMICONDUCTOR DEVICE
    2.
    发明公开
    CONTROL SYSTEM FOR SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20240355522A1

    公开(公告)日：2024-10-24

    申请号：US18413574

    申请日：2024-01-16

    Applicant: Mitsubishi Electric Corporation

    Inventor： Masanori TSUKUDA ,  Kakeru OTSUKA

    IPC: H01F17/00 ,  H01L25/16 ,  H03K17/56

    CPC classification number: H01F17/0013 ,  H01L25/16 ,  H03K17/56 ,  H01F2017/002

    Abstract: According to the present disclosure, a control system for semiconductor device includes a detection unit in which the detection unit is configured with a coil structure, an outgoing path, and a returning path, the coil structure includes a front layer, a back layer, inner side through-vias, and outer side through-vias, the outgoing path and the returning path are provided so as to form a circumference in the front layer or the back layer in plan view, the inner side through-vias and the outer side through-vias are provided at equal intervals along the circumference, one of the outgoing path or the returning path is connected to the inner side through-vias and the outer side through-vias in the front layer and the back layer, and at least portions other than periphery of the inner side through-vias or the outer through-vias overlap in plan view, and an other of the outgoing path or the returning path is provided along one of the outgoing path or the returning path on a side opposite to the coil structure with respect to the inner side through-vias or the outer side through-vias.

    Common-mode choke coil
    4.
    发明授权
    Common-mode choke coil 有权

    公开(公告)号：US12119153B2

    公开(公告)日：2024-10-15

    申请号：US17394304

    申请日：2021-08-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kouhei Matsuura ,  Atsuo Hirukawa ,  Hiroshi Ueki

    IPC: H01F27/28 ,  H01F17/00 ,  H01F27/29

    CPC classification number: H01F17/0013 ,  H01F27/29 ,  H01F2017/0093

    Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.4 mm. The respective lower-face electrode portions of the terminal electrodes each have an area of less than or equal to 0.034 μm2.

    INDUCTOR
    6.
    发明公开
    INDUCTOR 审中-公开

    公开(公告)号：US20240321503A1

    公开(公告)日：2024-09-26

    申请号：US18599609

    申请日：2024-03-08

    Applicant: TDK CORPORATION

    Inventor： Masashi Shimoyasu ,  Takahiro Yata ,  Masataka Yamamoto ,  Hiroyuki Abe ,  Daiki Saito ,  Akihiko Oide

    IPC: H01F27/23 ,  H01F17/00 ,  H01F17/02

    CPC classification number: H01F27/23 ,  H01F17/0013 ,  H01F17/02 ,  H01F2017/002

    Abstract: An inductor includes: an element body having a pair of end surfaces facing each other, and a side surface extending in a facing direction of the pair of end surfaces to connect the pair of end surfaces; and a through conductor disposed inside the element body and extending in the facing direction. The element body includes a first portion surrounding the through conductor, and a second portion positioned outward of the first portion, when viewed in the facing direction. The first portion is disposed spaced from the side surface. The first portion has a porosity higher than a porosity of the second portion.

    MULTILAYER INDUCTOR
    7.
    发明公开
    MULTILAYER INDUCTOR 审中-公开

    公开(公告)号：US20240312687A1

    公开(公告)日：2024-09-19

    申请号：US18599410

    申请日：2024-03-08

    Applicant: TDK CORPORATION

    Inventor： Takahiro Yata ,  Masashi Shimoyasu ,  Masataka Yamamoto ,  Hiroyuki Abe ,  Daiki Saito ,  Akihiko Oide

    IPC: H01F17/00 ,  H01F17/04

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F2017/0073

    Abstract: A multilayer inductor includes: an element body having a pair of end surfaces facing each other, and a side surface extending in a facing direction of the pair of end surfaces in such a way as to connect the pair of end surfaces; and a through conductor disposed inside the element body and extending in the facing direction. The element body includes a first portion surrounding the through conductor and a second portion positioned outward of the first portion, when viewed in the facing direction. The first portion is disposed spaced from the side surface. The first portion and the second portion have different magnetic permeabilities from each other.

    Coil electronic component and method of manufacturing the same
    8.
    发明授权
    Coil electronic component and method of manufacturing the same 有权

    公开(公告)号：US12094649B2

    公开(公告)日：2024-09-17

    申请号：US17083935

    申请日：2020-10-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Min Sung Choi

    IPC: H01F41/04 ,  H01F17/00 ,  H01F27/255 ,  H01F27/29

    CPC classification number: H01F41/041 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292

    Abstract: A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.

    Chip inductor and method for manufacturing same
    9.
    发明授权
    Chip inductor and method for manufacturing same 有权

    公开(公告)号：US12094631B2

    公开(公告)日：2024-09-17

    申请号：US17261787

    申请日：2019-02-22

    Applicant: ANHUI ANUKI TECHNOLOGIES CO., LTD.

    Inventor： Wei Cheng ,  Chengjie Zuo ,  Jun He

    IPC: H01F7/06 ,  H01F5/00 ,  H01F17/00

    CPC classification number: H01F17/0013 ,  H01F5/003

    Abstract: Provided is a chip inductor and manufacturing method thereof. The chip inductor includes: a pin layer, a plurality of insulating layers and a plurality of metal layers, where the insulating layers and the metal layers are arranged successively and alternately on the pin layer. Multiple patterned metal structures arranged in the plurality of metal layers are respectively electrically connected to form a multilayer plane spiral coil structure. The multilayer plane spiral coil structure has two ends electrically connected with respective pin structures in the pin layer.

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