公开(公告)号：US20060291019A1

公开(公告)日：2006-12-28

申请号：US11473398

申请日：2006-06-23

Applicant: David Grier ,  Kosta Ladavac ,  Joy Barker

Inventor： David Grier ,  Kosta Ladavac ,  Joy Barker

IPC: G03H1/00

CPC classification number: C09J5/00 ,  G03H2001/0077 ,  Y10S977/882

Abstract: A system and method for bonding and unbonding of small objects using small adhesive particles. The system and method includes the use of a plurality of optical tweezers to manipulate objects to be bonded and adhesive particles suspended in a fluid. The objects to be bonded (or unbonded) and the adhesive particles are positioned by lower power optical tweezers and then an intense bonding optical tweezer is activated to cause the adhesive to join the objects together (or used to unbond objects).

Abstract translation: 一种使用小粘合剂颗粒粘合和粘合小物体的系统和方法。 该系统和方法包括使用多个光学镊子来操纵待粘合的物体和悬浮在流体中的粘合剂颗粒。 待粘合（或未粘合）的物体和粘合剂颗粒由较低功率的光学镊子定位，然后激活强力粘合光学镊子以使粘合剂将物体连接在一起（或用于取消粘合物体）。