公开(公告)号：US20080229001A1

公开(公告)日：2008-09-18

申请号：US11800133

申请日：2007-05-04

Applicant: Li Hui Lu ,  Kun Lin Liu

Inventor： Li Hui Lu ,  Kun Lin Liu

IPC: G06F12/02 ,  G06F13/12

CPC classification number: G06F3/0661 ,  G06F3/0607 ,  G06F3/0688

Abstract: A solid memory module with extensible capacity includes at least a non-volatile memory module, each of which has at least a memory chip and a first connector, and at least a second connector, which electrically connects the first connector of the volatile memory module, at least a control unit and as a system interface. This control unit obtains external signals by this system interface and then transmits to this non-volatile memory module by the control unit to store or use the memory content.

Abstract translation: 具有可扩展容量的固体存储器模块包括至少一个非易失性存储器模块，每个非易失性存储器模块至少具有存储器芯片和第一连接器，以及至少第二连接器，其将易失性存储器模块的第一连接器电连接， 至少一个控制单元和一个系统接口。 该控制单元通过该系统接口获得外部信号，然后由控制单元向该非易失性存储器模块发送存储或使用存储器内容。

公开(公告)号：US20080224199A1

公开(公告)日：2008-09-18

申请号：US11800134

申请日：2007-05-04

Applicant: Li Hui Lu ,  Kun Lin Liu ,  Chih Chieh Ho ,  Jin Xian Lin

Inventor： Li Hui Lu ,  Kun Lin Liu ,  Chih Chieh Ho ,  Jin Xian Lin

IPC: H01L29/788

CPC classification number: G06F13/409

Abstract: A non-volatile memory module package capability of replacing, it may connected to a solid memory module, which includes a control unit, a system interface, and a first connector, the control unit may obtains external signals by the system interface, and then transmitted to this non-volatile memory module by the control unit to store or use the memory content. The package includes a substrate; a second connector is arranged on the substrate for inserting the first connector of the solid memory module; at least a non-volatile memory chip located on the substrate, and electrically connected the substrate and the second connector; at least a passive component is arranged on the substrate; and a compound resin is covered on the non-volatile memory chip and passive component.

Abstract translation: 一种非易失性存储器模块封装的替换能力，可以连接到包括控制单元，系统接口和第一连接器的固体存储器模块，控制单元可以通过系统接口获得外部信号，然后发送 由控制单元将该非易失性存储器模块存储或使用存储器内容。 所述包装包括基材; 第二连接器设置在基板上用于插入固态存储器模块的第一连接器; 至少一个位于所述衬底上的非易失性存储器芯片，并且电连接所述衬底和所述第二连接器; 至少一个无源元件布置在基片上; 并且复合树脂覆盖在非易失性存储芯片和无源部件上。

公开(公告)号：US20080228994A1

公开(公告)日：2008-09-18

申请号：US11800140

申请日：2007-05-04

Applicant: Li Hui Lu ,  Kun Lin Liu

Inventor： Li Hui Lu ,  Kun Lin Liu

IPC: G06F13/28

CPC classification number: G06F3/0661 ,  G06F3/0607 ,  G06F3/0688

Abstract: A solid memory module structure with extensible capacity includes at least a non-volatile memory module, each of which has at least a memory chip, a first connector, and a control unit. And A Solid memory module includes at least a second connector, which electrically connects the first connector of the volatile memory module, and a system interfac3. The control unit of the non-volatile memory module obtains external signals by this system interface and then transmits to this non-volatile memory module by the control unit to store or use the memory content.

Abstract translation: 具有可扩展容量的固体存储器模块结构包括至少一个非易失性存储器模块，每个非易失性存储器模块至少具有存储器芯片，第一连接器和控制单元。 而固体存储器模块包括至少第二连接器，其将易失性存储器模块的第一连接器电连接到系统接口3。 非易失性存储器模块的控制单元通过该系统接口获得外部信号，然后由控制单元向该非易失性存储器模块发送以存储或使用存储器内容。