公开(公告)号：US07737538B2

公开(公告)日：2010-06-15

申请号：US11979809

申请日：2007-11-08

Applicant: Chao-Chen Chen ,  Lin-Gi Yang ,  Chia-Chi Chou ,  Shih-Chieh Teng

Inventor： Chao-Chen Chen ,  Lin-Gi Yang ,  Chia-Chi Chou ,  Shih-Chieh Teng

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.

Abstract translation: 半导体封装。 本发明的半导体封装包括：包含至少一个具有光敏器件的暴露区域的衬底; 用于将暴露区域与外部空气隔离的盖子，其中所述基板或所述盖板中的一个是基座，而另一个是顶部结构; 和形成在基座上以形成空腔的坝，其中坝的顶部具有凹部，坝通过粘合剂附接到顶部结构，并且空腔对应于暴露的区域。

公开(公告)号：US20090121303A1

公开(公告)日：2009-05-14

申请号：US11979809

申请日：2007-11-08

Applicant: Chao-Chen Chen ,  Lin-Gi Yang ,  Chia-Chi Chou ,  Shih-Chieh Teng

Inventor： Chao-Chen Chen ,  Lin-Gi Yang ,  Chia-Chi Chou ,  Shih-Chieh Teng

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.

Abstract translation: 半导体封装。 本发明的半导体封装包括：包含至少一个具有光敏器件的暴露区域的衬底; 用于将暴露区域与外部空气隔离的盖子，其中所述基板或所述盖板中的一个是基座，而另一个是顶部结构; 和形成在基座上以形成空腔的坝，其中坝的顶部具有凹部，坝通过粘合剂附接到顶部结构，并且空腔对应于暴露的区域。