公开(公告)号：US10262951B2

公开(公告)日：2019-04-16

申请号：US14279601

申请日：2014-05-16

申请人： Jin Ho Kang ,  Godfrey Sauti ,  Cheol Park ,  Luke Gibbons ,  Sheila Ann Thibeault ,  Sharon E. Lowther ,  Robert G. Bryant

发明人： Jin Ho Kang ,  Godfrey Sauti ,  Cheol Park ,  Luke Gibbons ,  Sheila Ann Thibeault ,  Sharon E. Lowther ,  Robert G. Bryant

IPC分类号： H01L21/44 ,  H01L23/556 ,  H01L23/552 ,  H01L21/78 ,  H01L23/31 ,  H01L21/311 ,  H01L23/495 ,  H01L23/00

摘要： A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation.