专利检索 ap:"Sangpil Kim" 第 1 页

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发明申请
ELECTROSTATIC DISCHARGE POLYMER FILLER CONTAINING CARBON NANOTUBE ENCLOSED WITH THERMOPLATIC RESIN LAYER AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：含有热塑性树脂层的碳纳米管的静电放电聚合物填料及其制造方法

公开(公告)号：US20120298925A1

公开(公告)日：2012-11-29

申请号：US13512460

申请日：2011-12-14

申请人： Soowan Kim , Sangpil Kim , Changwon Lee

发明人： Soowan Kim , Sangpil Kim , Changwon Lee

IPC分类号： H01B1/04 , H01B1/02 , B82Y30/00 , B82Y40/00

CPC分类号： H01B1/124 , C08L101/12

摘要： The present invention relates to an electrically conductive polymer filler for preparing electrically conductive plastics and a preparation method thereof. More specifically, the invention relates to an electrically conductive polymer filler comprising carbon nanotube (CNT) microcapsules including carbon nanotubes encapsulated with a thermoplastic resin layer, and to a preparation method and an electrically conductive thermoplastic resin comprising the electrically conductive polymer filler.

摘要翻译： 本发明涉及一种用于制备导电塑料的导电聚合物填料及其制备方法。更具体地，本发明涉及包含碳纳米管（CNT）微胶囊的导电聚合物填料，其包括用热塑性树脂层包封的碳纳米管，以及包含导电聚合物填料的制备方法和导电热塑性树脂。