公开(公告)号：US07109465B2

公开(公告)日：2006-09-19

申请号：US10407540

申请日：2003-04-04

申请人： Boon How Kok ,  Soon Lee Tan ,  Wee Sin Tan

发明人： Boon How Kok ,  Soon Lee Tan ,  Wee Sin Tan

IPC分类号： G01J1/44

CPC分类号： G09G3/3413 ,  G09G2320/0626 ,  G09G2330/021 ,  G09G2360/144 ,  H04M1/22 ,  H04M2250/12 ,  H04W52/027 ,  H05B37/0218 ,  Y02B20/46

摘要： A system and method of ambient light detection with digitized output. A light sensitive device is coupled to electronic circuitry for receiving an output of the light sensitive device corresponding to a level of ambient light. The electronic circuitry compares the output to a threshold level. The threshold level corresponds to a desired level of light. The electronic circuitry for provides an output signal indicative of said desired level of light.

摘要翻译： 具有数字化输出的环境光检测系统和方法。 光敏设备耦合到电子电路，用于接收对应于环境光的水平的光敏设备的输出。 电子电路将输出与阈值电平进行比较。 阈值水平对应于所需的光照水平。 电子电路用于提供指示所述期望光强度的输出信号。

公开(公告)号：US20130105822A1

公开(公告)日：2013-05-02

申请号：US13282541

申请日：2011-10-27

申请人： YOU-FA WANG ,  SIN-HENG LIM ,  TECK-CHAI GOH ,  SOON-LEE TAN

发明人： YOU-FA WANG ,  SIN-HENG LIM ,  TECK-CHAI GOH ,  SOON-LEE TAN

IPC分类号： H01L31/12

CPC分类号： H01L31/125 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

摘要翻译： 集成感测封装结构包括由IR阻挡材料制成的衬底。 衬底具有在其顶表面上凹入地形成的第一容纳室和第二容纳室。 第一容纳室具有形成在其内壁的表面上的反射层。 LED单元设置在第一容纳室的底部。 多个第一导线与LED单元电连接并延伸到基板的外表面。 IR感测芯片设置在第二接收室中。 多个第二导线与IR感测芯片电连接并延伸到衬底的外表面。 IR块盖覆盖在基板的顶表面上，形成对应于IR感测芯片的至少一个开口。

公开(公告)号：US08587103B2

公开(公告)日：2013-11-19

申请号：US13282541

申请日：2011-10-27

申请人： You-Fa Wang ,  Sin-Heng Lim ,  Teck-Chai Goh ,  Soon-Lee Tan

发明人： You-Fa Wang ,  Sin-Heng Lim ,  Teck-Chai Goh ,  Soon-Lee Tan

IPC分类号： H01L31/09

CPC分类号： H01L31/125 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

摘要翻译： 集成感测封装结构包括由IR阻挡材料制成的衬底。 衬底具有在其顶表面上凹入地形成的第一容纳室和第二容纳室。 第一容纳室具有形成在其内壁的表面上的反射层。 LED单元设置在第一容纳室的底部。 多个第一导线与LED单元电连接并延伸到基板的外表面。 IR感测芯片设置在第二接收室中。 多个第二导线与IR感测芯片电连接并延伸到衬底的外表面。 IR块盖覆盖在基板的顶表面上，形成对应于IR感测芯片的至少一个开口。

公开(公告)号：US20060132454A1

公开(公告)日：2006-06-22

申请号：US11013556

申请日：2004-12-16

申请人： Deng-Peng Chen ,  Wee-Sin Tan ,  Kai-Koon Lee ,  Chee-Heng Wong ,  Soon-Lee Tan ,  Masatoshi Yamai ,  Pak-Hong Yee ,  Rani Saravanan ,  Seok Chan

发明人： Deng-Peng Chen ,  Wee-Sin Tan ,  Kai-Koon Lee ,  Chee-Heng Wong ,  Soon-Lee Tan ,  Masatoshi Yamai ,  Pak-Hong Yee ,  Rani Saravanan ,  Seok Chan

IPC分类号： G09G5/00

CPC分类号： G01V8/20 ,  G06F3/0421

摘要： In one embodiment, a touch detection system and method is achieved having high resolution by forming an integrated array of alternating emitters and detectors. Using integration techniques, the detectors can be made much larger than the emitters while the gaps between the emitters and detectors are maintained relatively small. Thus, high resolution is achieved without dramatically increasing the number of emitter/detector pairs. In one embodiment each array is positioned on an edge of a display such that the emitter of one array is lined up (on axis with) a detector of an opposing display. In one embodiment, the touch detection system and method operates to detect the amplitude of signals arriving from opposing arrays so as to precisely determine the location of a touched position. Off-axis scanning can be employed to increase sensitivity.

摘要翻译： 在一个实施例中，通过形成交替发射器和检测器的集成阵列，实现了具有高分辨率的触摸检测系统和方法。 使用集成技术，可以使检测器比发射器大得多，同时发射器和检测器之间的间隙保持相对较小。 因此，在不显着增加发射器/检测器对的数量的情况下实现高分辨率。 在一个实施例中，每个阵列位于显示器的边缘上，使得一个阵列的发射器与相对的显示器的检测器对齐（在轴上）。 在一个实施例中，触摸检测系统和方法操作以检测从相对阵列到达的信号的幅度，以便精确地确定触摸位置的位置。 可以采用离轴扫描来提高灵敏度。