-
公开(公告)号：US08690604B2
公开(公告)日：2014-04-08
申请号：US13276769
申请日：2011-10-19
申请人： Wayne Samuel Davis
发明人： Wayne Samuel Davis
IPC分类号： H01R13/648 , H01R12/16
CPC分类号： H01R23/688 , H01R9/2408 , H01R12/724 , H01R13/6581
摘要： A receptacle assembly includes a front housing having a mating end and a loading end. A contact module is coupled to the loading end and includes a frame assembly having a plurality of contacts and a dielectric frame supporting the contacts. The dielectric frame has first and second sides and channels between the contacts that extend at least partially through the dielectric frame between the first and second sides. The contacts extend from the dielectric frame for electrical termination. Ground conductors are received in corresponding channels and provide electrical shielding between corresponding contacts. A ground shield is coupled to the first side. The ground shield has side shields that extend along sides of the contacts to provide electrical shielding along sides of the contacts. The ground shield has shield tabs that engage corresponding ground conductors to electrically connect the ground shield to the ground conductors.
摘要翻译： 插座组件包括具有配合端和装载端的前壳体。 接触模块联接到装载端并且包括具有多个触点的框架组件和支撑触点的电介质框架。 电介质框架具有在触头之间的第一和第二侧面以及至少部分地延伸通过第一和第二侧之间的电介质框架的通道。 触头从电介质框架延伸出来用于电气端接。 接地导体被接收在相应的通道中并在相应的触头之间提供电屏蔽。 接地屏蔽耦合到第一侧。 接地屏蔽具有侧面屏蔽，其沿着触点的侧面延伸，以提供沿触头侧面的电屏蔽。 接地屏蔽具有与相应的接地导体接合的屏蔽接头，以将接地屏蔽电连接到接地导体。
-
公开(公告)号：US20130210282A1
公开(公告)日：2013-08-15
申请号：US13370399
申请日：2012-02-10
IPC分类号： H01R33/00
CPC分类号： H01R12/724 , H01R13/629 , H01R13/6471
摘要： A connector system having right angle, board-mounted header and receptacle connectors includes both a power interface and a signal interface for transmitting power and data signals there between. Optionally, the connectors may have features that allow the corresponding circuit boards to be offset. The connectors may have features that provide guidance for alignment of the header and receptacle connectors. The connectors may have features to enhance the electrical performance of the conductors defining the signal paths through the connector system. The connectors may have features that orient the components of the header and receptacle connectors for mounting to the circuit boards to maintain the true positions of the contacts for mounting to the circuit board.
摘要翻译： 具有直角，板上插头和插座连接器的连接器系统包括电源接口和用于在其间传输电力和数据信号的信号接口。 可选地，连接器可以具有允许相应的电路板被偏移的特征。 连接器可以具有为标题和插座连接器的对准提供引导的特征。 连接器可以具有增强限定通过连接器系统的信号路径的导体的电性能的特征。 连接器可以具有将集管和插座连接器的部件定向到安装到电路板的特征，以保持用于安装到电路板的触点的真实位置。
-
公开(公告)号：US20130210246A1
公开(公告)日：2013-08-15
申请号：US13370053
申请日：2012-02-09
IPC分类号： H01R12/00 , H01R13/648
CPC分类号： H01R12/716 , H01R12/7082 , H01R12/737 , H01R13/6587 , H05K1/141 , H05K3/366 , H05K2201/044 , H05K2201/10295
摘要： A receptacle assembly for a midplane connector system has a receptacle housing having openings receiving signal contacts and ground shields of a header assembly. The receptacle assembly includes contact modules coupled to the receptacle housing that each have a leadframe, a dielectric frame and a ground shield. The leadframe has signal contacts arranged in pairs carrying differential signals that are generally arranged along a leadframe plane with mating portions at ends thereof that have at least two points of contact electrically connected to a corresponding signal contact of the header assembly. The dielectric frame holds the signal contacts. The ground shield is coupled to a side of the dielectric frame and has ground tabs extending into the dielectric frame to provide electrical shielding between the pairs of signal contacts and grounding beams electrically connected to ground shields of the header assembly.
摘要翻译： 用于中平面连接器系统的插座组件具有插座壳体，其具有容纳头部组件的信号触头和接地屏蔽的开口。 插座组件包括联接到插座壳体的接触模块，其中每个具有引线框架，电介质框架和接地屏蔽件。 引线框架具有成对布置的具有差分信号的信号触点，其通常沿着引线框架平面布置，其端部处的配合部分具有电连接到插头组件的相应信号触头的至少两个接点。 电介质框架保持信号触点。 接地屏蔽耦合到电介质框架的一侧，并且具有延伸到电介质框架中的接地片，以在电连接到插头组件的接地屏蔽的信号触点对和接地梁之间提供电屏蔽。
-
公开(公告)号：US08469745B2
公开(公告)日：2013-06-25
申请号：US12950232
申请日：2010-11-19
IPC分类号： H01R13/648
CPC分类号： H01R43/24 , H01R12/724 , H01R12/737 , H01R13/6587
摘要： An electrical connector system may include a plurality of wafer assemblies. Each wafer assembly may include a first overmolded array of electrical contacts defining a plurality of apertures; a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, the second overmolded array of electrical contacts defining a plurality of apertures; and a conductive ground bracket positioned in the wafer assembly between the first overmolded array of electrical contacts and the second array of electrical contacts. The conductive ground bracket defines a first array of ridges, each ridge of the first array of ridges positioned in an aperture of the first overmolded array of electrical contacts. The conductive ground bracket defines a second array of ridges, each ridge of the second array of ridges positioned in an aperture of the second overmolded array of electrical contacts.
摘要翻译： 电连接器系统可以包括多个晶片组件。 每个晶片组件可以包括限定多个孔的电触头的第一包覆成型阵列; 电触头的第二包覆成型阵列，其被配置为与所述第一包覆成型的电触头阵列组装，所述第二包覆成型的电触头阵列限定多个孔; 以及导电接地支架，其定位在所述晶片组件之间的所述第一包覆成型电触点阵列和所述第二电触头阵列之间。 导电接地支架限定第一脊阵列，第一阵列脊的每个脊位于第一包覆成型的电触点阵列的孔中。 导电接地支架限定第二脊阵列，第二脊阵列的每个脊位于第二包覆成型电触头阵列的孔中。
-
公开(公告)号：US08430691B2
公开(公告)日：2013-04-30
申请号：US13182193
申请日：2011-07-13
申请人： Wayne Samuel Davis
发明人： Wayne Samuel Davis
IPC分类号： H01R13/648
CPC分类号： H01R13/6585 , H01R9/2408 , H01R12/724
摘要： A header assembly includes a header housing configured for mating with a receptacle assembly. The header housing has a base wall. Header signal contacts are coupled to the base wall. The header signal contacts are configured to be terminated to a circuit board. The header signal contacts are configured to be terminated to corresponding receptacle signal contacts of the receptacle assembly. Header shields are coupled to the base wall. The header shields at least partially surround, and provide electrical shielding for, corresponding header signal contacts. The header shields have walls and mating tabs that extend from corresponding walls. The mating tabs are configured to engage corresponding ground shields of the receptacle assembly.
摘要翻译： 头部组件包括构造成与插座组件配合的头部外壳。 插头外壳具有底壁。 标题信号触点耦合到底壁。 标题信号触点被配置为端接到电路板。 标题信号触点被配置为终止于插座组件的对应插座信号触点。 标头屏蔽件联接到底壁。 插头屏蔽至少部分环绕，并为相应的插头信号触点提供电气屏蔽。 头罩具有从相应的壁延伸的壁和配合突片。 配合翼片被配置成接合插座组件的相应接地屏蔽。
-
公开(公告)号：US20130102192A1
公开(公告)日：2013-04-25
申请号：US13276769
申请日：2011-10-19
申请人： WAYNE SAMUEL DAVIS
发明人： WAYNE SAMUEL DAVIS
IPC分类号： H01R13/648
CPC分类号： H01R23/688 , H01R9/2408 , H01R12/724 , H01R13/6581
摘要： A receptacle assembly includes a front housing having a mating end and a loading end. A contact module is coupled to the loading end and includes a frame assembly having a plurality of contacts and a dielectric frame supporting the contacts. The dielectric frame has first and second sides and channels between the contacts that extend at least partially through the dielectric frame between the first and second sides. The contacts extend from the dielectric frame for electrical termination. Ground conductors are received in corresponding channels and provide electrical shielding between corresponding contacts. A ground shield is coupled to the first side. The ground shield has side shields that extend along sides of the contacts to provide electrical shielding along sides of the contacts. The ground shield has shield tabs that engage corresponding ground conductors to electrically connect the ground shield to the ground conductors.
摘要翻译： 插座组件包括具有配合端和装载端的前壳体。 接触模块联接到装载端并且包括具有多个触点的框架组件和支撑触点的电介质框架。 电介质框架具有在触头之间的第一和第二侧面以及至少部分地延伸通过第一和第二侧之间的电介质框架的通道。 触头从电介质框架延伸出来用于电气端接。 接地导体被接收在相应的通道中并在相应的触头之间提供电屏蔽。 接地屏蔽耦合到第一侧。 接地屏蔽具有侧面屏蔽，其沿着触点的侧面延伸，以提供沿触头侧面的电屏蔽。 接地屏蔽具有与相应的接地导体接合的屏蔽接头，以将接地屏蔽电连接到接地导体。
-
公开(公告)号：US08408939B2
公开(公告)日：2013-04-02
申请号：US12950210
申请日：2010-11-19
IPC分类号： H01R13/648
CPC分类号： H01R12/724 , H01R12/737 , H01R13/6587 , H01R43/24
摘要： An electrical connector system for mounting to a substrate is disclosed. The electrical connector system may include a plurality of wafer assemblies defining a mating end and a mating end. Each wafer assembly may include a first overmolded array of electrical contacts, each electrical contact defining an electrical mating connector extending past an edge of the overmold of the first overmolded array of electrical contacts at the mating end of the wafer assembly; a first ground shield configured to be assembled with the first overmolded array of electrical contacts; and a second overmolded array of electrical contacts configured to be assembled with the first overmolded array of electrical contacts, each electrical contact defining an electrical mating connector extending past an edge of the overmold of the second overmolded array of electrical contacts at the mating end of the wafer assembly.
摘要翻译： 公开了一种用于安装到基板的电连接器系统。 电连接器系统可以包括限定配合端和配合端的多个晶片组件。 每个晶片组件可以包括第一包覆成型的电接触阵列，每个电接触限定了在晶片组件的配合端处延伸超过第一包覆成型的电接触阵列的包覆成型体的边缘的电配合连接器; 第一接地屏蔽，其被配置为与所述第一包覆成型的电触点阵列组装; 以及构造成与第一包覆成型的电触头阵列组装的第二包覆成型的电触头阵列，每个电触头限定电连接器延伸穿过第二包覆成型的电触点阵列的边缘，电连接器的配合端 晶圆组件。
-
公开(公告)号：US20130017725A1
公开(公告)日：2013-01-17
申请号：US13182214
申请日：2011-07-13
IPC分类号： H01R9/03
CPC分类号： H01R13/6587
摘要： A receptacle assembly includes a front housing configured for mating with a header assembly. A contact module is coupled to the front housing. The contact module includes a conductive holder that has a first side and an opposite second side. The conductive holder has a front coupled to the front housing. The conductive holder holds a frame assembly. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts. The dielectric frame is received in the conductive holder. The contacts extend from the conductive holder for electrical termination. A ground shield is coupled to the first side. The ground shield is electrically connected to the conductive holder. The ground shield has grounding beams that extend therefrom. The grounding beams extend forward of the front of the conductive holder for electrical connection to a corresponding header shield of the header assembly. First and second side shields are coupled to the first and second sides, respectively. The first and second side shields are electrically connected to the conductive holder. The first and second side shields have grounding fingers that extend therefrom. The grounding fingers extend forward of the front of the conductive holder for electrical connection to a corresponding header shield of the header assembly.
摘要翻译： 插座组件包括被配置为与插头组件配合的前壳体。 接触模块耦合到前壳体。 接触模块包括具有第一侧和相对的第二侧的导电保持器。 导电保持器具有联接到前壳体的前部。 导电支架支撑框架组件。 框架组件包括多个触点和支撑触点的电介质框架。 电介质框架被容纳在导电保持器中。 触点从导电支架延伸，用于电气端接。 接地屏蔽耦合到第一侧。 接地屏蔽电连接到导电支架。 接地屏蔽具有从其延伸的接地梁。 接地梁从导电保持器的前部向前延伸，用于电连接到插头组件的对应插头护罩。 第一和第二侧面屏蔽分别联接到第一和第二侧。 第一和第二侧面屏蔽电连接到导电支架。 第一和第二侧护罩具有从其延伸的接地指状物。 接地指状物从导电保持器的前部向前延伸，用于电连接到头部组件的对应的头部护罩。
-
公开(公告)号：US20110143591A1
公开(公告)日：2011-06-16
申请号：US12636141
申请日：2009-12-11
IPC分类号： H01R13/648
CPC分类号： H01R13/6587 , H01R12/724
摘要： A contact module is provided for an electrical connector. The contact module includes a housing having a mating edge, a mounting edge, and a side. An electrical lead is held by the housing. The electrical lead extends from a mating contact to a mounting contact. The mating contact extends outwardly from the mating edge of the housing. The mounting contact extends outwardly from the mounting edge of the housing. An inner ground shield is mounted on the housing. The inner ground shield includes a housing side segment that extends over at least a portion of the side of the housing between the mating and mounting edges thereof. An outer ground shield is mounted on the housing. The outer ground shield extends over at least a portion of the housing side segment of the inner ground shield.
摘要翻译： 为电连接器提供接触模块。 接触模块包括具有配合边缘，安装边缘和侧面的壳体。 电气引线由外壳固定。 电引线从配合触头延伸到安装触点。 配合触头从壳体的配合边缘向外延伸。 安装触头从外壳的安装边缘向外延伸。 内部接地屏蔽安装在外壳上。 内部接地屏蔽包括壳体侧段，其在壳体的配合和安装边缘之间的至少一部分侧壁上延伸。 外部接地屏蔽安装在外壳上。 外部接地屏蔽层在内部接地屏蔽的外壳侧段的至少一部分上延伸。
-
公开(公告)号：US20100178779A1
公开(公告)日：2010-07-15
申请号：US12353550
申请日：2009-01-14
IPC分类号： H01R12/14
CPC分类号： H01R13/514 , H01R12/724 , H01R12/737 , H01R13/518 , H01R13/6471
摘要： An orthogonal connector system for connecting a first circuit board and a second circuit board oriented orthogonally with respect to the first circuit board includes a receptacle assembly and a header assembly mated with the receptacle assembly. The receptacle assembly is connected to the first circuit board and the header assembly is connected to the second circuit board. The receptacle assembly and the header assembly both have a housing and contact modules held within the corresponding housing. The contact modules have contact tails extending from a mounting edge thereof, where the contact tails of the receptacle connector are connected to the first circuit board and the contact tails of the header assembly are connected to the second circuit board. The contact modules have mating contacts extending from a mating edge thereof, where the mating edges are generally orthogonal with respect to the mounting edges. The mating contacts of the receptacle assembly are directly connected to the mating contacts of the header assembly. The mounting edge of the receptacle assembly is generally orthogonal with respect to the mounting edge of the header assembly.
摘要翻译： 用于连接第一电路板和相对于第一电路板正交定向的第二电路板的正交连接器系统包括插座组件和与插座组件配合的插头组件。 插座组件连接到第一电路板，并且插头组件连接到第二电路板。 插座组件和插头组件都具有保持在相应壳体内的壳体和触头模块。 接触模块具有从其安装边缘延伸的接触尾部，其中插座连接器的接触尾部连接到第一电路板，并且插头组件的接触尾部连接到第二电路板。 接触模块具有从其配合边缘延伸的配合触头，其中配合边缘相对于安装边缘大致正交。 插座组件的配合触点直接连接到插头组件的配合触头。 插座组件的安装边缘通常与插头组件的安装边缘正交。
-
-
-
-
-
-
-
-
-
搜索结果
94 条记录 (耗时 0.031 秒)
