SUBSTRATE TERMINAL-EQUIPPED PRINTED CIRCUIT BOARD

    公开(公告)号:US20180062290A1

    公开(公告)日:2018-03-01

    申请号:US15683051

    申请日:2017-08-22

    Inventor: Hideki Goto

    Abstract: Provided is a substrate terminal-equipped printed circuit board having configured to enable a substrate terminal to be fixed to a printed circuit board without using a pedestal, and to reduce the pressure and the insertion force applied to an inner surface of a through hole when the substrate terminal is press-fitted therein. A conducting portion of a substrate terminal includes: a press-fitted portion disposed at a proximal end portion thereof and is press-fitted into a through hole; and a loosely inserted portion that extends from the press-fitted portion to a distal end portion thereof, has a narrower width than the press-fitted portion, and is inserted into the through hole with a gap therebetween, and the press-fitted portion of the conducting portion is in pressure contact only with printed wiring provided on a surface layer of the printed circuit board and with an insulating layer located immediately below the printed wiring.

    CONNECTOR FOR PRINTED CIRCUIT BOARD
    6.
    发明申请

    公开(公告)号:US20170318673A1

    公开(公告)日:2017-11-02

    申请号:US15143376

    申请日:2016-04-29

    Inventor: Warren Meggitt

    Abstract: A printed circuit board is provided. The board includes a plurality of vias through the printed circuit board, each having a first section with a first width, a second section with a second width less than the first width, and a third section with a third width greater than the second width and less than the first width. The second section is located between the first section and the third section, the first and second sections are plated, and the third section lacks plating. At least one of the plurality of vias has the first width dimensioned to receive a connector pin inserted through the first face. A further at least one of the plurality of vias has the first width dimensioned to receive a further connector pin inserted through the second face. Further versions of the printed circuit board and method of making a printed circuit board are provided.

    Electronic apparatus and manufacturing method of electronic apparatus

    公开(公告)号:US09743531B2

    公开(公告)日:2017-08-22

    申请号:US15163897

    申请日:2016-05-25

    Inventor: Toshihiro Miyake

    Abstract: An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.

Patent Agency Ranking