公开(公告)号：US20100013058A1

公开(公告)日：2010-01-21

申请号：US12520986

申请日：2008-10-03

申请人： Kaoru Shibata ,  Shinji Okabayashi ,  Yasuhiro Honzu ,  Masato Irikura ,  Fumitake Nakanishi

发明人： Kaoru Shibata ,  Shinji Okabayashi ,  Yasuhiro Honzu ,  Masato Irikura ,  Fumitake Nakanishi

IPC分类号： H01L23/00 ,  G01N21/95

CPC分类号： G01N21/9505 ,  G01N21/894 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Affords semiconductor wafers that achieve uniformization of semiconductor films. In a semiconductor wafer (1), between one and twenty pinholes (3) are formed per wafer for two-inch diameter semiconductor wafers (1). An effect whereby the warp in the semiconductor wafer (1) following semiconductor film formation is reduced, and dimensional variation following photolithographic exposure is reduced can thereby be obtained. This is presumed to be because dislocations in the semiconductor wafer (1) front side are extinguished by the presence of the pinholes (3). Accordingly, this can serve to make the quality of the semiconductor films consistent, make the performance of semiconductor devices consistent, and prevent fracture of the semiconductor wafer (1).

摘要翻译： 提供实现半导体膜均匀化的半导体晶片。 在半导体晶片（1）中，对于2英寸直径的半导体晶片（1），每个晶片形成一个至二十个针孔（3）之间。 从而可以获得半导体膜形成后的半导体晶片（1）的翘曲减小，光刻曝光后的尺寸变化减小的效果。 这被认为是因为半导体晶片（1）前侧的位错由于针孔（3）的存在而熄灭。 因此，这可以使半导体膜的质量一致，使半导体器件的性能一致，并且防止半导体晶片（1）的断裂。