公开(公告)号：US20240130077A1

公开(公告)日：2024-04-18

申请号：US18547194

申请日：2022-02-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Qihong Nie ,  Steven D. Solomonson ,  Vadim N. Savvateev ,  Nicholas A. Proite ,  Myron K. Jordan ,  Glendon D. Kappel ,  Elizaveta Y. Plotnikov ,  Dylan T. Cosgrove ,  Andrew K. Penning ,  Sung Moon

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20272

Abstract: A multichannel manifold cold plate with microchannels for cooling electronics. A main inlet is on a side of the microchannels opposite the cold plate and includes inlet channels with nozzles adjacent the microchannels. A main outlet is on a side of the microchannels opposite the cold plate and includes outlet channels with nozzles adjacent the microchannels. The inlet channels are interleaved with the outlet channels. In operation, the main inlet delivers a cooling fluid to the cold plate microchannels via the inlet channels and nozzles, and the main outlet receives the cooling fluid from the microchannels via the outlet channels and nozzles. This configuration provides a cooling fluid distribution pattern for efficient cooling of the electronics.

公开(公告)号：US20230230852A1

公开(公告)日：2023-07-20

申请号：US18011263

申请日：2021-07-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Elizaveta Y. Plotnikov ,  Sung W. Moon ,  Nicholas A. Proite ,  Myron K. Jordan

IPC: H01L21/48 ,  H01L23/473

CPC classification number: H01L21/4882 ,  H01L23/473 ,  B33Y80/00

Abstract: A cold plate having a copper base plate and a plurality of fins on the copper base plate. The fins are porous and made by 3D printing a copper-silver alloy on the copper base plate. Alternatively, the fins can be 3D printed and then adhered to the copper base plate with a brazing material. The copper base plate is placed on electronics to be cooled, such as a chip package, using a thermal interface material. An optional manifold can be placed on the copper base plate for circulating a coolant across the fins.