Electronic devices incorporating flexible component layers with interlocking devices

    公开(公告)号:US11116090B2

    公开(公告)日:2021-09-07

    申请号:US16464634

    申请日:2017-11-22

    Abstract: Electronic Devices Incorporating Flexible Component Layers with Interlocking Devices At least some aspects of the present disclosure directs to an electronic device 100 comprising a rigid member 100A, 100B, a flexible component layer 130, and an interlocking device 110A, HOB disposed between the flexible component layer and the rigid member. The flexible component layer has at least two sections when the flexible component layer is flexed. The interlocking device comprises a first interlocking component attached to or integrated with the flexible component layer, and a second interlocking component attached to or integrated with the rigid member configured to engage with the first interlocking component, such that the engagement prevents the separation of the flexible component layer from the rigid member along a direction generally perpendicular to a surface of the rigid member.

Patent Agency Ranking