公开(公告)号：US20180359880A1

公开(公告)日：2018-12-13

申请号：US16007179

申请日：2018-06-13

Applicant: ABB Schweiz AG

Inventor： Clemens Christiaan Van Der Veer ,  Fabio Tombelli ,  Filippo Chimento ,  Mauro Piazzesi ,  Daniel Gerber

IPC: H05K7/20 ,  F28F3/02

CPC classification number: H05K7/20545 ,  F28F3/025 ,  H02J7/0042 ,  H05K7/209 ,  H05K7/20909

Abstract: Heat exchanger structure for a rack assembly formed by a shaped body of thermally conductive material.The heat exchanger structure comprises a first heat exchanging portion adapted to provide a mechanical support for one or more power electronic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electronic components.The heat exchanger structure comprises a second heat exchanging portion adapted to provide a mechanical support for one or more power electromagnetic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electromagnetic components.

公开(公告)号：US10939586B2

公开(公告)日：2021-03-02

申请号：US16007179

申请日：2018-06-13

Applicant: ABB Schweiz AG

Inventor： Clemens Christiaan Van Der Veer ,  Fabio Tombelli ,  Filippo Chimento ,  Mauro Piazzesi ,  Daniel Gerber

IPC: H05K7/20 ,  F28F3/02 ,  H02J7/00

Abstract: Heat exchanger structure for a rack assembly formed by a shaped body of thermally conductive material. The heat exchanger structure comprises a first heat exchanging portion adapted to provide a mechanical support for one or more power electronic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electronic components. The heat exchanger structure comprises a second heat exchanging portion adapted to provide a mechanical support for one or more power electromagnetic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electromagnetic components.