公开(公告)号：US20160360646A1

公开(公告)日：2016-12-08

申请号：US15101288

申请日：2013-12-13

Applicant: ABB TECHNOLOGY LTD

Inventor： Rolf ERIKSSON

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20409 ,  H05K7/1401 ,  H05K7/1415 ,  H05K7/1468 ,  H05K7/20418 ,  H05K7/20536

Abstract: There is provided an electronics module. The electronics module includes a circuit board. The circuit board includes electronic equipment. The electronics module includes a housing. The housing encloses the circuit board. The electronics module includes a thermally conductive panel. The thermally conductive panel at least partly covers at least two opposite side surfaces of the housing. There is also provided an arrangement including at least two such electronics modules. There is also provided a method for providing such an electronics module.

Abstract translation: 提供了一个电子模块。 电子模块包括电路板。 电路板包括电子设备。 电子模块包括壳体。 外壳包围电路板。 电子模块包括导热面板。 导热面板至少部分地覆盖壳体的至少两个相对的侧表面。 还提供了包括至少两个这样的电子模块的布置。 还提供了一种用于提供这种电子模块的方法。