公开(公告)号：US09270251B2

公开(公告)日：2016-02-23

申请号：US13833614

申请日：2013-03-15

Applicant: ADAPTIVE METHODS, INC.

Inventor： Peter Owen ,  Conrad Zeglin ,  Barclay Roman ,  Mark Meister

IPC: H05K5/02 ,  H05K7/18 ,  H03H9/05 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H03H9/058 ,  H05K3/301 ,  H05K3/32 ,  H05K3/3421 ,  H05K2201/10083 ,  H05K2201/10424 ,  H05K2201/10962 ,  Y10T29/4913

Abstract: A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier lid attached to the carrier bottom. The carrier bottom has an opening extending partially through the carrier bottom from a top surface thereof and the opening is configured such that when a piezoelectric device to be mounted in the carrier is inserted into the carrier bottom, the piezoelectric device is at least partially recessed within the carrier bottom. The metal contacts include a cantilevered end configured for electrical connection to a piezoelectric device. The carrier lid is configured to retain a piezoelectric device within the carrier bottom and to apply substantially even pressure across a top surface of a piezoelectric device. The method includes mounting the carrier bottom to the circuit board prior to insertion of the piezoelectric device and connection of the carrier lid.

Abstract translation: 公开了一种用于在电路板上安装例如表面声波（SAW）器件的压电器件的载体，以及使用这种载体将压电器件安装在电路板上的方法。 载体包括载体底部，多个金属触点和附接到载体底部的载体盖。 载体底部具有从其顶表面部分延伸穿过载体底部的开口，并且开口构造成使得当要安装在载体中的压电装置插入载体底部时，压电装置至少部分地凹入 载体底部。 金属触点包括构造成用于电连接到压电装置的悬臂端。 载体盖构造成将压电装置保持在载体底部内并且跨越压电装置的顶表面施加基本均匀的压力。 该方法包括在插入压电装置和承载盖的连接之前将载体底部安装到电路板。

公开(公告)号：US20140268624A1

公开(公告)日：2014-09-18

申请号：US13833614

申请日：2013-03-15

Applicant: ADAPTIVE METHODS, INC.

Inventor： Peter Owen ,  Conrad Zeglin ,  Barclay Roman ,  Mark Meister

IPC: H01L41/053 ,  H01L41/311

CPC classification number: H03H9/058 ,  H05K3/301 ,  H05K3/32 ,  H05K3/3421 ,  H05K2201/10083 ,  H05K2201/10424 ,  H05K2201/10962 ,  Y10T29/4913

Abstract: A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier lid attached to the carrier bottom. The carrier bottom has an opening extending partially through the carrier bottom from a top surface thereof and the opening is configured such that when a piezoelectric device to be mounted in the carrier is inserted into the carrier bottom, the piezoelectric device is at least partially recessed within the carrier bottom. The metal contacts include a cantilevered end configured for electrical connection to a piezoelectric device. The carrier lid is configured to retain a piezoelectric device within the carrier bottom and to apply substantially even pressure across a top surface of a piezoelectric device. The method includes mounting the carrier bottom to the circuit board prior to insertion of the piezoelectric device and connection of the carrier lid.

Abstract translation: 公开了一种用于在电路板上安装例如表面声波（SAW）器件的压电器件的载体，以及使用这种载体将压电器件安装在电路板上的方法。 载体包括载体底部，多个金属触点和连接到载体底部的载体盖。 载体底部具有从其顶表面部分延伸穿过载体底部的开口，并且开口构造成使得当要安装在载体中的压电装置插入载体底部时，压电装置至少部分地凹入 载体底部。 金属触点包括构造成用于电连接到压电装置的悬臂端。 载体盖构造成将压电装置保持在载体底部内并且跨越压电装置的顶表面施加基本均匀的压力。 该方法包括在插入压电装置和承载盖的连接之前将载体底部安装到电路板。