SEMICONDUCTOR MOUNTING MATERIAL FILLER AND METHOD FOR PRODUCING SEMICONDUCTOR MOUNTING MATERIAL FILLER, AND SEMICONDUCTOR MOUNTING MATERIAL

    公开(公告)号:US20230352435A1

    公开(公告)日:2023-11-02

    申请号:US18206789

    申请日:2023-06-07

    CPC classification number: H01L24/27 H01L24/29 H01L2224/2711 H01L2224/2919

    Abstract: Provided is a method for producing an electronic material filler having excellent performance. The method includes a burning step of putting a particle raw material in flame obtained by burning combustible carbon-free gas containing no carbon to form a particle material to be contained in the electronic material filler. By adopting, as combustible gas, combustible gas containing no carbon, conductive particles formed of carbon are not generated in principle. Therefore, a step of removing the conductive particles formed of carbon by sieving or the like is not required. Particularly, carbon derived from hydrocarbon gas is adhered to and formed on, for example, the surface of the particle material or is formed in the particle material. Therefore, the carbon may not be completely removed by sieving or the like. However, the production method of the present invention prevents the carbon from being mixed in principle.

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