SEMICONDUCTOR MOUNTING MATERIAL FILLER AND METHOD FOR PRODUCING SEMICONDUCTOR MOUNTING MATERIAL FILLER, AND SEMICONDUCTOR MOUNTING MATERIAL

    公开(公告)号:US20230352435A1

    公开(公告)日:2023-11-02

    申请号:US18206789

    申请日:2023-06-07

    CPC classification number: H01L24/27 H01L24/29 H01L2224/2711 H01L2224/2919

    Abstract: Provided is a method for producing an electronic material filler having excellent performance. The method includes a burning step of putting a particle raw material in flame obtained by burning combustible carbon-free gas containing no carbon to form a particle material to be contained in the electronic material filler. By adopting, as combustible gas, combustible gas containing no carbon, conductive particles formed of carbon are not generated in principle. Therefore, a step of removing the conductive particles formed of carbon by sieving or the like is not required. Particularly, carbon derived from hydrocarbon gas is adhered to and formed on, for example, the surface of the particle material or is formed in the particle material. Therefore, the carbon may not be completely removed by sieving or the like. However, the production method of the present invention prevents the carbon from being mixed in principle.

    MODIFIED METAL OXIDE PARTICLE MATERIAL AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20230046554A1

    公开(公告)日:2023-02-16

    申请号:US17965027

    申请日:2022-10-13

    Abstract: A modified metal oxide particle material includes: a metal oxide particle material having, on a surface thereof, a functional group other than a phenyl group; and a modifying material formed of a silicon-containing compound having a phenyl group. The modifying material is adhered to the surface of the metal oxide particle material. When the modified metal oxide particle material is washed with methyl ethyl ketone, a ratio (C/H) of a carbon content C (% by mass) to a surface area H (m2) per 1 g is 0.05 or less, after the washing. The ratio (C/H) is reduced by 0.1 or more, and the modifying material is removed by 50% or more by mass, after the washing compared with before the washing.

    SURFACE-MODIFIED PARTICLE MATERIAL AND SLURRY COMPOSITION

    公开(公告)号:US20230024335A1

    公开(公告)日:2023-01-26

    申请号:US17953430

    申请日:2022-09-27

    Abstract: A particle material that has high dispersibility in a dispersion medium such as toluene having high hydrophobicity, and a slurry composition in which the particle material is used, are provided for solving the problem. A surface-modified particle material of the present invention includes: a particle material formed of an inorganic material; and a surface treatment agent formed of a silane compound having a first functional group that has any of C, N, and O atoms away over five or more atoms from Si to which an alkoxide is bound, the surface treatment agent allowing surface treatment of the particle material in such an amount that a degree of hydrophobicity becomes not less than 30%. Dispersibility is enhanced also in a dispersion medium having high hydrophobicity in a case where a functional group having a predetermined structure is introduced so as to impart predetermined or higher hydrophobicity.

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