公开(公告)号：US11228310B2

公开(公告)日：2022-01-18

申请号：US17080785

申请日：2020-10-26

Applicant: Analog Devices Global Unlimited Company

Inventor： Ying Zhao ,  Alan O'Donnell ,  Michael James Twohig ,  Olly J. Kierse ,  James Thomas Sheeran ,  Michael C. W. Coln ,  Paul W. Stevens ,  Bruce A. Hecht ,  Padraig Fitzgerald ,  Mark Schirmer

IPC: H01H59/00 ,  H03K17/94 ,  H01L25/16

Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

公开(公告)号：US20210067160A1

公开(公告)日：2021-03-04

申请号：US17080785

申请日：2020-10-26

Applicant: Analog Devices Global Unlimited Company

Inventor： Ying Zhao ,  Alan O'Donnell ,  Michael James Twohig ,  Olly J. Kierse ,  James Sheeran ,  Michael C.W. Coln ,  Paul W. Stevens ,  Bruce A. Hecht ,  Padraig Fitzgerald ,  Mark Schirmer

IPC: H03K17/94 ,  H01L25/16 ,  H01H59/00

Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

公开(公告)号：US20190288686A1

公开(公告)日：2019-09-19

申请号：US16137640

申请日：2018-09-21

Applicant: Analog Devices Global Unlimited Company

Inventor： Ying Zhao ,  Alan O'Donnell ,  Michael James Twohig ,  Olly J. Kierse ,  James Thomas Sheeran ,  Michael C.W. Coln ,  Paul W. Stevens ,  Bruce A. Hecht ,  Padraig Fitzgerald Fitzgerald ,  Mark Schirmer

IPC: H03K17/94 ,  H01H59/00 ,  H01L25/16

Abstract: Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.

公开(公告)号：US09590129B2

公开(公告)日：2017-03-07

申请号：US14945255

申请日：2015-11-18

Applicant: ANALOG DEVICES GLOBAL

Inventor： Shrenik Deliwala ,  Ying Zhao ,  Seokphyo Chun

IPC: H01L31/12 ,  H01L31/18

CPC classification number: H01L31/12 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48465

Abstract: An optical sensor module is disclosed. The optical sensor module can include a housing comprising an air cavity. An optical emitter die can be disposed in the air cavity of the housing. A top surface of the optical emitter die can face a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing. An optical sensor die can be disposed in the air cavity of the housing adjacent the optical emitter die. The optical sensor die can be spaced from the optical emitter die by a lateral distance. A top surface of the optical sensor die can face the first side of the housing. There may be no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die.

Abstract translation: 公开了一种光学传感器模块。 光学传感器模块可以包括包括空气腔的壳体。 光发射器管芯可以设置在壳体的空气腔中。 光发射器管芯的顶表面可以面向壳体的第一侧，光发射器管芯被配置为朝向壳体的第一侧发光。 可以将光学传感器模具设置在与发光体裸片相邻的壳体的空气腔中。 光学传感器芯片可以与光发射器管芯间隔一个横向距离。 光学传感器模具的顶表面可以面向壳体的第一侧。 在光学传感器管芯和光发射器管芯之间可能没有隔膜，该光学传感器管芯和光发射器管芯光学地分离光学传感器管芯和光发射器管芯。

公开(公告)号：US20160141440A1

公开(公告)日：2016-05-19

申请号：US14945255

申请日：2015-11-18

Applicant: ANALOG DEVICES GLOBAL

Inventor： Seokphyo Chun ,  Ying Zhao ,  Shrenik Deliwala

IPC: H01L31/12 ,  H01L31/18

CPC classification number: H01L31/12 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48465

Abstract: An optical sensor module is disclosed. The optical sensor module can include a housing comprising an air cavity. An optical emitter die can be disposed in the air cavity of the housing. A top surface of the optical emitter die can face a first side of the housing, the optical emitter die configured to emit light towards the first side of the housing. An optical sensor die can be disposed in the air cavity of the housing adjacent the optical emitter die. The optical sensor die can be spaced from the optical emitter die by a lateral distance. A top surface of the optical sensor die can face the first side of the housing. There may be no septum between the optical sensor die and the optical emitter die that optically separates the optical sensor die and the optical emitter die.

Abstract translation: 公开了一种光学传感器模块。 光学传感器模块可以包括包括空气腔的壳体。 光发射器管芯可以设置在壳体的空气腔中。 光发射器管芯的顶表面可以面向壳体的第一侧，光发射器管芯被配置为朝向壳体的第一侧发光。 可以将光学传感器模具设置在与发光体裸片相邻的壳体的空气腔中。 光学传感器芯片可以与光发射器管芯间隔一个横向距离。 光学传感器模具的顶表面可以面向壳体的第一侧。 在光学传感器管芯和光发射器管芯之间可能没有隔膜，该光学传感器管芯和光发射器管芯光学地分离光学传感器管芯和光发射器管芯。