公开(公告)号：US20190319011A1

公开(公告)日：2019-10-17

申请号：US16366476

申请日：2019-03-27

Applicant: ANALOG DEVICES GLOBAL UNLIMITED COMPANY

Inventor： Rigan McGeehan ,  Cillian Burke ,  Alan J. O'Donnell

IPC: H01L25/065 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00

Abstract: An integrated device package is disclosed. The package can include a carrier and an integrated device die having a front side and a back side. A mounting structure can serve to mount the back side of the integrated device die to the carrier. The mounting structure can comprise a first layer over the carrier and a second element between the back side of the integrated device die and the first layer. The first layer can comprise a first insulating material that adheres to the carrier, and the second element can comprise a second insulating material.