公开(公告)号：US20190259647A1

公开(公告)日：2019-08-22

申请号：US16273808

申请日：2019-02-12

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH ,  FANG JIE LIM ,  KARRTHIK PARATHITHASAN ,  ANAND MAHADEV ,  SHOJU VAYYAPRON ,  CHAI BOON XIAN

IPC: H01L21/683 ,  C23C14/50

Abstract: Embodiments of a process kit for processing reduced size substrates are provided herein. In some embodiments, a process kit includes a deposition ring having an annular body; and a plurality of protrusions extending upwardly from the annular body and disposed about and equidistant from a central axis of the annular body, wherein an angle between a first protrusion and a second protrusion is between about 140° and about 180°.