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    BRIDGING FRONT OPENING UNIFIED POD (FOUP)
    3.
    发明申请
    BRIDGING FRONT OPENING UNIFIED POD (FOUP) 审中-公开

    公开(公告)号：US20190244845A1

    公开(公告)日：2019-08-08

    申请号：US15956481

    申请日：2018-04-18

    Applicant: APPLIED MATERIALS, INC.

    Inventor： KARRTHIK PARATHITHASAN ,  FANG JIE LIM ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH

    IPC: H01L21/673 ,  H01L21/67

    CPC classification number: H01L21/67376 ,  H01L21/67126

    Abstract: A bridging front opening unified pod (FOUP) is provided herein. In some embodiments, the bridging FOUP includes a bottom floor, side walls, a ceiling and a back wall that forms an enclosure volume having a front opening, a plurality of supports coupled to the side walls and extending into the enclosure volume, wherein the plurality of supports are configured to support a substrate carrier, a base plate assembly comprising a base plate coupled to the bottom floor, a pair of L-brackets coupled to the base plate, wherein each L-brackets includes a short lift pin, a long lift pin coupled to the base plate, wherein the height of the short lift pins and the long lift pin is selected such that the substrate is kept level when disposed thereon, and a docking support disposed proximate the base plate assembly and configured to support a substrate carrier.

    METHODS AND APPARATUS FOR CORRECTING SUBSTRATE DEFORMITY
    4.
    发明申请
    METHODS AND APPARATUS FOR CORRECTING SUBSTRATE DEFORMITY 有权
    校正基板变形的方法和装置

    公开(公告)号：US20160322234A1

    公开(公告)日：2016-11-03

    申请号：US15142220

    申请日：2016-04-29

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Jen Sern LEW ,  Tuck Foong KOH ,  Sriskantharajah THIRUNAVUKARASU ,  Karthik ELUMALAI ,  ENG SHENG PEH ,  JUN-LIANG SU

    IPC: H01L21/324 ,  F27B9/02 ,  F27B9/10 ,  H01L21/67

    CPC classification number: H01L21/3247 ,  F27B9/02 ,  F27B9/10 ,  F27B17/0025 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/67288

    Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.

    Abstract translation: 本文提供了用于校正衬底畸形的方法和装置的实施例。 在一些实施例中，衬底平坦化系统包括：具有第一衬底支撑件和第一喷头的第一处理室，其中所述第一衬底支撑件不包括夹紧机构; 第一加热器，设置在所述第一基板支撑件中以加热放置在所述第一基板支撑件的第一支撑表面上的基板; 第二加热器，被配置为将流过所述第一喷淋头的处理气体加热到所述第一处理室的第一处理容积中; 以及具有第二基板支撑件的第二处理室，其中所述第二基板支撑件不被加热，并且其中所述第一处理室和所述冷却室都是非真空室。

    SUBSTRATE TRANSFER CHAMBER
    7.
    发明申请
    SUBSTRATE TRANSFER CHAMBER 审中-公开
    基板传送室

    公开(公告)号：US20160133494A1

    公开(公告)日：2016-05-12

    申请号：US14933635

    申请日：2015-11-05

    Applicant: APPLIED MATERIALS, INC.

    Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH ,  SRINIVAS D. NEMANI ,  ARVIND SUNDARRAJAN ,  AVINASH AVULA ,  ELLIE Y. YIEH

    IPC: H01L21/677 ,  H01L21/673 ,  B25J11/00

    CPC classification number: H01L21/67778 ,  H01L21/67201 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67379 ,  H01L21/67389

    Abstract: Embodiments of substrate transfer chambers are provided herein. In some embodiments, a substrate transfer chamber includes a body having an interior volume, wherein a bottom portion of the body includes a first opening; an adapter plate coupled to the bottom portion of the body to couple the substrate transfer chamber to a load lock chamber of a substrate processing system; wherein the adapter plate includes a second opening aligned with the first opening to fluidly couple the interior volume with an inner volume of the load lock chamber; a cassette support disposed in the interior volume to support a substrate cassette; and a lift actuator coupled to the cassette support to lower or raise the substrate cassette into or out of the load lock chamber.

    Abstract translation: 本文提供了基板传送室的实施例。 在一些实施例中，衬底传送室包括具有内部容积的主体，其中主体的底部包括第一开口; 耦合到所述主体的底部的适配器板，以将所述衬底传送室耦合到衬底处理系统的负载锁定室; 其中所述适配器板包括与所述第一开口对准的第二开口，以将所述内部容积与所述负载锁定室的内部容积流体连接; 设置在所述内部容积中以支撑衬底盒的盒支架; 以及联接到所述盒支撑件的升降致动器，以将所述基板盒降低或升高到所述负载锁定室中或从所述负载锁定室中升起。

    MULTI-CASSETTE CARRYING CASE
    8.
    发明申请
    MULTI-CASSETTE CARRYING CASE 审中-公开
    多箱运输箱

    公开(公告)号：US20160133491A1

    公开(公告)日：2016-05-12

    申请号：US14933651

    申请日：2015-11-05

    Applicant: APPLIED MATERIALS, INC.

    Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  ENG SHENG PEH ,  SRINIVAS D. NEMANI ,  ARVIND SUNDARRAJAN ,  AVINASH AVULA ,  ELLIE Y. YIEH ,  MICHAEL RICE ,  GINETTO ADDIEGO

    IPC: H01L21/673 ,  B25J11/00

    Abstract: Embodiments of multi-cassette carrying cases are provided herein. In some embodiments a multi-cassette carrying case includes: a body having an inner volume; a door coupled to the body to selectively seal off the inner volume; and a plurality of cassette holders disposed in the inner volume to hold one or more substrate cassettes. In some embodiments, a method of transferring substrates includes: placing a substrate in a substrate cassette, wherein an inner volume of the substrate cassette is sealed from an environment outside of the substrate cassette; and placing the substrate cassette in a multi-cassette carrying case.

    Abstract translation: 这里提供了多盒式携带箱的实施例。 在一些实施例中，多卡带手提箱包括：具有内部容积的主体; 一个门连接到主体以选择性地密封内部容积; 以及设置在所述内部容积中以容纳一个或多个衬底盒的多个盒座。 在一些实施例中，传送衬底的方法包括：将衬底放置在衬底盒中，其中衬底盒的内部体积与衬底盒外的环境密封; 并将衬底盒放置在多盒式手提箱中。

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