公开(公告)号：US20160033205A1

公开(公告)日：2016-02-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： KALLOL BERA ,  KIM VELLORE ,  ANDREW CONSTANT ,  JACOB NEWMAN ,  JEFFREY BLAHNIK ,  JASON SCHALLER ,  WILLIAM WEAVER ,  ROBERT VOPAT ,  BENJAMIN RIORDON

IPC: F28D9/00

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

Abstract translation: 本发明提供了多基板热管理装置的实施例。 在一些实施例中，多基板热管理装置包括彼此垂直布置的多个板; 多个通道，其延伸穿过所述多个板中的每一个; 供应歧管，其包括在第一位置处联接到所述多个板的供应通道; 以及返回歧管，其包括在第二位置处经由多个腿联接到所述多个板的返回通道，其中所述供应和返回通道流体地联接到所述多个通道以使传热流体流过所述多个板。