公开(公告)号：US20240064908A1

公开(公告)日：2024-02-22

申请号：US17889473

申请日：2022-08-17

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： David G. Siegfried ,  David R. Peterson ,  Joesph Sudik, JR.

IPC: H05K3/00 ,  B60R16/02 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/0014 ,  B60R16/02 ,  H05K1/0212 ,  H05K3/0026 ,  H05K1/189

Abstract: A system and method for shaping a flexible circuit (FC) having a set of conductive traces disposed within a set of insulation layers and a shaped FC, each involve using a non-conductive tool defining complimentary first and second tool portions and a shape therebetween, the tool being configured to receive a portion of the FC therebetween the first and second tool portions, a set of conductive heating elements arranged substantially in parallel with each other and disposed within the first and second tool portions, and a power source configured to provide power to the conductive heating elements causing the conductive heating elements to generate heat energy to shape the FC portion without removing any of the FC portion.