公开(公告)号：US20240098880A1

公开(公告)日：2024-03-21

申请号：US18525872

申请日：2023-12-01

申请人： KMW INC.

发明人： Bae Mook JEONG ,  Kyo Sung JI ,  Seong Min AHN ,  Chi Back RYU ,  Jae Eun KIM ,  Seung Min LEE ,  Ki Hun PARK ,  Won Jun PARK ,  Jun Woo YANG

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K3/32

CPC分类号： H05K1/0212 ,  H05K1/184 ,  H05K3/321 ,  H05K2201/0355 ,  H05K2201/06 ,  H05K2201/0715 ,  H05K2201/10409

摘要： The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.

公开(公告)号：US11917747B2

公开(公告)日：2024-02-27

申请号：US17695776

申请日：2022-03-15

申请人： Chicony Electronics Co., Ltd.

发明人： Chien-Yueh Chen

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K1/05 ,  H04N23/52 ,  H04N23/54

CPC分类号： H05K1/0212 ,  H04N23/52 ,  H04N23/54 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/141 ,  H05K1/05 ,  H05K2201/049 ,  H05K2201/10083 ,  H05K2201/10106

摘要： A circuit board module includes a circuit board, a metal core printed circuit board, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembling region. The metal core printed circuit board is on the assembling region and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other. The second circuit layer is electrically connected to the circuit board. The thermal conductivity of the metal core printed circuit board is greater than the thermal conductivity of the substrate. The heating element is on the metal core printed circuit board and is electrically connected to the first circuit layer. An electronic device having the circuit board module is also provided.

公开(公告)号：US11915995B2

公开(公告)日：2024-02-27

申请号：US17677357

申请日：2022-02-22

申请人： FUJI ELECTRIC CO., LTD.

发明人： Shun Fukuchi

IPC分类号： H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC分类号： H01L23/40 ,  H05K1/0212 ,  H05K7/20927 ,  H05K2201/10227

摘要： A power converter includes a housing including a convex radiator that radiates heat from a heater element and protrudes toward a board, in which the board and the heater element are arranged, and an urging member that is arranged between the board and a bottom surface of the housing and urges the heater element toward a first side surface of the convex radiator of the housing.

公开(公告)号：US11859094B2

公开(公告)日：2024-01-02

申请号：US17743757

申请日：2022-05-13

申请人： LMS Consulting Group, LLC

发明人： Shuyong Xiao ,  Richard C. Abbott

IPC分类号： C09D11/52 ,  C09D11/102 ,  H05B3/14 ,  H05K1/09 ,  C09D11/107 ,  H05K1/02 ,  C09D11/10 ,  H05B3/34 ,  H05K1/03 ,  C09D11/037 ,  H05B3/10 ,  H05K1/16 ,  H05K3/12

CPC分类号： C09D11/52 ,  C09D11/037 ,  C09D11/10 ,  C09D11/102 ,  C09D11/107 ,  H05B3/10 ,  H05B3/146 ,  H05B3/34 ,  H05K1/0212 ,  H05K1/038 ,  H05K1/095 ,  H05K1/097 ,  H05B2203/011 ,  H05B2203/013 ,  H05B2203/02 ,  H05B2203/036 ,  H05K1/162 ,  H05K3/12 ,  H05K2201/10196

摘要： An article comprising a heater that comprises a high-resistance magnification (HRM) PTC ink deposited on a flexible substrate to form one or more resistors. The HRM PTC ink has a resistance magnification of at least 20 in a temperature range of at least 20 degrees Celsius above a switching temperature of the ink, the resistance magnification being defined as a ratio between a resistance of the double-resin ink at a temperature ‘T’ and a resistance of the double-resin ink at 25 degrees Celsius.

公开(公告)号：US11832382B2

公开(公告)日：2023-11-28

申请号：US17518982

申请日：2021-11-04

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jae Beom Byun

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K5/02

CPC分类号： H05K1/0212 ,  H05K5/0213 ,  H05K5/0247 ,  H05K2201/10159

摘要： A printed circuit board (PCB) including: a negative thermal coefficient (NTC) thermistor which provides an electrical signal received from outside the PCB, wherein an electrical resistance of the NTC thermistor varies according to a negative thermal coefficient; and a heating pattern which receives the electrical signal from the NTC thermistor, wherein the heating pattern includes a positive thermal coefficient (PTC) thermistor with an electrical resistance that varies according to a positive thermal coefficient, wherein the PTC thermistor has a first thermal coefficient of resistance at a first critical temperature or below and changes to a second thermal coefficient of resistance above the first critical temperature, and the NTC thermistor has a third thermal coefficient of resistance at a second critical temperature or below and changes to a fourth thermal coefficient of resistance above the second critical temperature.

公开(公告)号：US20230232525A1

公开(公告)日：2023-07-20

申请号：US17576708

申请日：2022-01-14

申请人： Dell Products L.P.

发明人： Eric Michael Tunks ,  Richard Mark Eiland

IPC分类号： H05K1/02 ,  H05K3/32

CPC分类号： H05K1/0212 ,  H05K3/325 ,  H05K2201/10409

摘要： A computing device includes a printed circuit board, a base, and a heater apparatus. The printed circuit board is secured to the base. The heater apparatus includes a heater component and a plurality of heater wires, and the heater component is disposed between the printed circuit board and the base.

公开(公告)号：US20230229206A1

公开(公告)日：2023-07-20

申请号：US17576658

申请日：2022-01-14

申请人： Dell Products L.P.

发明人： Eric Michael Tunks ,  John Randolph Stuewe ,  Ayedin Nikazm

IPC分类号： H05K1/02 ,  H05K7/14 ,  G05D23/19 ,  G06F1/18 ,  G05B15/02

CPC分类号： H05K1/0212 ,  G05B15/02 ,  G05D23/1927 ,  G06F1/185 ,  H05K7/1487 ,  H05B2203/013 ,  H05B2203/016

摘要： A computing device includes a peripheral component interconnect (PCI) card and a heater apparatus. The heater apparatus is located proximate to the PCI card and configured to heat the PCI card.

公开(公告)号：US20230209699A1

公开(公告)日：2023-06-29

申请号：US17560531

申请日：2021-12-23

申请人： Xerox Corporation

发明人： Hendrikus Adrianus Anthonius Verheijen

IPC分类号： H05K1/02

CPC分类号： H05K1/0212 ,  H05K1/0213 ,  H05K2201/10151

摘要： A humidity-adjusted power supply includes a power supply circuit (e.g., relatively higher-voltage circuit) connected to a printed circuit board. The power supply circuit is adapted to provide output voltage to a voltage load. The humidity-adjusted power supply also includes a humidity control circuit (e.g., relatively lower-voltage circuit) connected to the printed circuit board adjacent the power supply circuit. The humidity control circuit outputs a heater control signal to a heater that is also connected to the printed circuit board. The heater is in a location to receive the heater control signal from the humidity control circuit. The power supply circuit and the humidity control circuit are positioned, relative to each other, on the printed circuit board to experience the same environmental conditions.

公开(公告)号：US20190232292A1

公开(公告)日：2019-08-01

申请号：US16380195

申请日：2019-04-10

申请人： Roche Diagnostics Operations, Inc.

发明人： Reiner Stein ,  Martin Mertens ,  Werner Heidt

IPC分类号： B01L7/04 ,  H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  B01L9/00 ,  G01N33/49

CPC分类号： B01L7/04 ,  B01L9/52 ,  B01L2300/0609 ,  B01L2300/0663 ,  B01L2300/08 ,  B01L2300/1805 ,  B01L2300/1883 ,  G01N21/84 ,  G01N27/3271 ,  G01N33/48707 ,  G01N33/4905 ,  H05K1/0212 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10151 ,  H05K2203/1115

摘要： A test element support comprises a heating element for heating a test element for analytical examination of a sample. The heating element comprises a substrate, which is made of at least one substrate material. The substrate comprises at least one active area configured for being heated and at least one non-active area outside the active area. The active and the non-active areas are separated by at least one thermal insulation element. The thermal insulation element has a lower thermal conductivity than the substrate material. The thermal insulation element is fully or partially embedded into the substrate. The test element support further comprises at least one heater. The heater comprises at least one heater substrate and the heater substrate is attached to the substrate, wherein the heater substrate is attached to a back face of the substrate. The back face opposes a front face of the substrate contacting the test element.

公开(公告)号：US20190215951A1

公开(公告)日：2019-07-11

申请号：US15866991

申请日：2018-01-10

申请人： Hamilton Sundstrand Corporation

发明人： Mark Hamilton Severson ,  Ryan W. Schmid

IPC分类号： H05K1/02 ,  G01R31/28 ,  G01R31/04 ,  H05K3/34 ,  H05B3/26 ,  H01L23/34 ,  G01R31/00

CPC分类号： H05K1/0212 ,  G01R31/008 ,  G01R31/048 ,  G01R31/2849 ,  G01R31/2875 ,  H01L23/345 ,  H05B3/265 ,  H05K1/0271 ,  H05K3/34 ,  H05K2201/068 ,  H05K2201/10151 ,  H05K2201/10159

摘要： A system for reducing low cycle fatigue of a soldered connection includes a controller and a heating element operatively connected to the controller. The system also includes a printed wire board soldered in connection with an electronic component. The controller is configured to retrieve a signal indicative of a temperature of the electronic component, and compare the temperature to a stored predetermined range of operating temperatures. Responsive to determining that the temperature of the electronic component is less than a lower threshold temperature of the predetermined range of operating temperatures, the controller transmits a signal to the heating element that causes the heating element to heat the electronic component. The controller then saves, to an operatively connected computer readable memory, a magnitude of temperature difference and a number of times that magnitude is reached. The controller uses the stored information to track the life of the electronic component.