公开(公告)号：US20250085646A1

公开(公告)日：2025-03-13

申请号：US18720609

申请日：2022-12-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Kirill Urievich SOBOLEV ,  Krishanu SHOME

IPC: G03F9/00

Abstract: Spots of illumination directed at a target are described. Ghost reflections often prevalent in wafer alignment sensors are reduced or eliminated. First, second, and third optical elements are described. The first optical element receives illumination along a first axis, reflects a first portion of the illumination away from the first axis, and transmits a second portion of the illumination along the first axis. The second first optical element receives the first portion of the reflected illumination and at least partially reflects a third portion of the illumination along a second axis. The third first optical element receives and fully reflects a fourth portion of the illumination along a third axis. The second portion, third and fourth portions of the illumination are directed toward the target at different angles relative to each other to create three different spots of illumination.

公开(公告)号：US20220100109A1

公开(公告)日：2022-03-31

申请号：US17415682

申请日：2019-12-12

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Tamer Mohamed Tawfik Ahmed Mohamed ELAZHARY ,  Franciscus BIJNEN ,  Alessandro POLO ,  Kirill Urievich SOBOLEV ,  Simon Reinald HUISMAN ,  Justin Lloyd KREUZER

IPC: G03F9/00 ,  G02B26/08

Abstract: An apparatus for and method of determining the alignment of a substrate in which a multiple alignment marks are simultaneously illuminated with spatially coherent radiation and the light from the illuminated marks is collected in parallel to obtain information on the positions of the marks and distortions within the marks.