公开(公告)号：US20210240070A1

公开(公告)日：2021-08-05

申请号：US17048875

申请日：2019-04-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Dennis DE GRAAF ,  Richard BEAUDRY ,  Maxime BIRON ,  Paul JANSSEN ,  Thijs KATER ,  Kevin KORNELSEN ,  Michael Alfred Josephus KUIJKEN ,  Jan Hendrik Willem KUNTZEL ,  Stephane MARTEL ,  Maxim Aleksandrovich NASALEVICH ,  Guido SALMASO ,  Pieter-Jan VAN ZWOL

IPC: G03F1/64 ,  G03F7/20 ,  H01L21/033 ,  H01L21/027

Abstract: A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidising environment. In any aspect, the pellicle may include a metal nitride layer.

公开(公告)号：US20240302736A1

公开(公告)日：2024-09-12

申请号：US18618406

申请日：2024-03-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Dennis DE GRAAF ,  Richard BEAUDRY ,  Maxime BIRON ,  Paul JANSSEN ,  Thijs KATER ,  Kevin KORNELSEN ,  Michael Alfred Josephus KUIJKEN ,  Jan Hendrik Willem KUNTZEL ,  Stephane MARTEL ,  Maxim Aleksandrovich NASALEVICH ,  Guido SALMASO ,  Pieter-Jan VAN ZWOL

IPC: G03F1/64 ,  G03F1/62 ,  G03F7/00

CPC classification number: G03F1/64 ,  G03F1/62 ,  G03F7/70983

Abstract: A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidizing environment. In any aspect, the pellicle may include a metal nitride layer.