公开(公告)号：US20180239395A1

公开(公告)日：2018-08-23

申请号：US15900349

申请日：2018-02-20

Applicant: ASUSTEK COMPUTER INC.

Inventor： San-Feng LIN ,  Yen-Yu CHEN

IPC: G06F1/16 ,  H05K5/04

CPC classification number: G06F1/1656 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1662 ,  H05K5/0017 ,  H05K5/04

Abstract: A casing assembly of an electronic device is provided. The casing assembly of the electronic device is configured to connect a connecting assembly. The connecting assembly comprises a metal casing; and an injection-molded frame. The injection-molded frame includes a first surface and a second surface, the first surface is fixed to the metal casing, and the second surface is configured with a plurality of connecting structures. The connecting structures are fixed to the connecting assembly, and the connecting assembly is assembled to the metal casing via the connecting structures.