PORTABLE ELECTRONIC DEVICE CAPABLE OF ENHANCING HEAT DISSIPATION

    公开(公告)号:US20180267570A1

    公开(公告)日:2018-09-20

    申请号:US15593285

    申请日:2017-05-11

    IPC分类号: G06F1/16

    摘要: A portable electronic device includes a host module having a housing with an accommodation space, a display module and a lift structure. The display module is pivotally connected to the housing by a shaft. The lift structure includes a bottom cover covering the accommodation space, a swing member and a follower member. The bottom cover includes an abutment portion including an abutment surface and located on an end surface of the bottom cover adjacent to the accommodation space. The swing member is in the accommodation space and connected to the shaft. The swing member moves with the display module. The follower member connects to the swing member and contacts the abutment surface. The follower member moves in a first direction according to swinging of the swing member, therefore the follower member abuts against the abutment surface and the bottom cover moves in a second direction to lift up the housing.

    CASING ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME

    公开(公告)号:US20180239395A1

    公开(公告)日:2018-08-23

    申请号:US15900349

    申请日:2018-02-20

    IPC分类号: G06F1/16 H05K5/04

    摘要: A casing assembly of an electronic device is provided. The casing assembly of the electronic device is configured to connect a connecting assembly. The connecting assembly comprises a metal casing; and an injection-molded frame. The injection-molded frame includes a first surface and a second surface, the first surface is fixed to the metal casing, and the second surface is configured with a plurality of connecting structures. The connecting structures are fixed to the connecting assembly, and the connecting assembly is assembled to the metal casing via the connecting structures.