公开(公告)号：US11161145B2

公开(公告)日：2021-11-02

申请号：US16575115

申请日：2019-09-18

Applicant: ASUSTEK COMPUTER INC.

Inventor： Guo-Lin Yang ,  Yu-Chun Yang ,  Po-Wen Huang

IPC: B05D7/14 ,  B05D3/06 ,  B05D7/00 ,  B05D5/06 ,  H02P29/40 ,  H02K5/02

Abstract: A processing method for a housing includes: providing a housing; forming a color layer on the housing; forming an ultraviolet curable layer on the color layer and executing a photo-curing process on the ultraviolet curable layer, materials of the ultraviolet curable layer including a light sensitive resin and a nano metal material; and forming an optical coating layer on the ultraviolet curable layer.