公开(公告)号：US20140198451A1

公开(公告)日：2014-07-17

申请号：US14144506

申请日：2013-12-30

Applicant: ASUSTeK COMPUTER INC.

Inventor： Chung-Wei KUO ,  Kuo-Chen HUANG ,  Kuan-Kun TANG

IPC: G01K7/00 ,  H05K7/20

CPC classification number: G01K1/026 ,  G01K2217/00 ,  G06F1/206 ,  H05K7/20209 ,  Y02D10/16

Abstract: A heat-dissipation system and a matrix thermal sensing circuit are provided. The heat-dissipation is used in an electronic device. The electronic device comprises a circuit board and a plurality of load elements disposed on the circuit board. The matrix thermal sensing circuit includes a current sensing module and a calculation module. The current sensing module includes a plurality of sensing nodes. Each sensing node is electrically connected to a current feeding terminal of one corresponding load element, and senses the working current of the corresponding load element respectively. The calculation module is connected to the current sensing module and is used to determine thermal state of the location of the sensing node according to the working current respectively.

Abstract translation: 提供散热系统和矩阵热感测电路。 散热用于电子设备。 电子设备包括电路板和设置在电路板上的多个负载元件。 矩阵热感测电路包括电流感测模块和计算模块。 电流感测模块包括多个感测节点。 每个感测节点电连接到一个对应的负载元件的馈电端子，并且分别感测相应的负载元件的工作电流。 计算模块连接到电流检测模块，用于分别根据工作电流来确定感测节点位置的热状态。